Devices for quality control of welded joints of leads of packageless chips

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Bibliographische Detailangaben
Datum:2013
1. Verfasser: V. G. Spirin
Format: Artikel
Sprache:Englisch
Veröffentlicht: 2013
Schriftenreihe:Technology and design in electronic equipment
Online Zugang:http://jnas.nbuv.gov.ua/article/UJRN-0000405027
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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author V. G. Spirin
author_facet V. G. Spirin
author_sort V. G. Spirin
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spelling open-sciencenbuvgovua-845132024-04-16T18:39:12Z Devices for quality control of welded joints of leads of packageless chips V. G. Spirin 2225-5818 2013 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000405027 Article
spellingShingle Technology and design in electronic equipment
V. G. Spirin
Devices for quality control of welded joints of leads of packageless chips
title Devices for quality control of welded joints of leads of packageless chips
title_full Devices for quality control of welded joints of leads of packageless chips
title_fullStr Devices for quality control of welded joints of leads of packageless chips
title_full_unstemmed Devices for quality control of welded joints of leads of packageless chips
title_short Devices for quality control of welded joints of leads of packageless chips
title_sort devices for quality control of welded joints of leads of packageless chips
url http://jnas.nbuv.gov.ua/article/UJRN-0000405027
work_keys_str_mv AT vgspirin devicesforqualitycontrolofweldedjointsofleadsofpackagelesschips