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Fomin, A.V.
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Fomin, A.V.
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Fomin, A.V.
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Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials
by
Kravetsky, M.Yu.
,
Sypko, S.A.
,
Fomin, A.V.
Published in
Semiconductor Physics Quantum Electronics & Optoelectronics
(2002)
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2
Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
by
Pashchenko, G.A.
,
Kravetskyi, M.Yu.
,
Fomin, A.V.
Published in
Semiconductor Physics Quantum Electronics & Optoelectronics
(2015)
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3
Balance model for contactless chemo-mechanical polishing of wafers
by
Grigoriev, N.N.
,
Kravetsky, M.Yu.
,
Paschenko, G.A.
,
Sypko, S.A.
,
Fomin, A.V.
Published in
Semiconductor Physics Quantum Electronics & Optoelectronics
(2002)
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