Integrated through-silicon-via-based inductor design in buck converter for improved efficiency

• Видавець: National Technical University "Kharkiv Polytechnic Institute" and State Institution “Institute of Technical Problems of Magnetism of the National Academy of Sciences of Ukraine”
• Дата: 2023
• Автори: Namoune, A., Taleb, R., Mansour, N., Benzidane, M. R., Boukortt, A.
• Формат: Стаття
• Мова: English
• Опубліковано: National Technical University "Kharkiv Polytechnic Institute" and State Institution “Institute of Technical Problems of Magnetism of the National Academy of Sciences of Ukraine” 2023
• Теми: індуктор на основі кремнію; 3D-інтеграція; знижуючий перетворювач; ефективність; through-silicon-via-based inductor; 3D integration; buck converter; efficiency
• Онлайн доступ: http://eie.khpi.edu.ua/article/view/273795

Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the d...