Stamp stress analysis with low temperature nanoimprint lithography
High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samp...
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| Дата: | 2016 |
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| Автори: | , , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
НТК «Інститут монокристалів» НАН України
2016
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| Назва видання: | Functional Materials |
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| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/121489 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
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irk-123456789-1214892017-06-15T03:05:44Z Stamp stress analysis with low temperature nanoimprint lithography Hongwen Sun Xiaochao Ma Chenhui Hu Technology High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samples do not sustain high temperature. However, LTNIL need to optimize the press parameters in order to fully transfer patterns. Finite Element Method (FEM) is an excellent approach to examine the filling process. The stamp stress was simulated from four points of view, imprint pressure, imprint temperature, stamp pattern and stamp material. It was found that the stress in the stamp corners is especially bigger than other areas, the stress increases with the stamps aspect ratio increases, and stress distribution is more uniform for dense pattern stamp. 2016 Article Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. 1027-5495 DOI: dx.doi.org/10.15407/fm23.03.517 http://dspace.nbuv.gov.ua/handle/123456789/121489 en Functional Materials НТК «Інститут монокристалів» НАН України |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| language |
English |
| topic |
Technology Technology |
| spellingShingle |
Technology Technology Hongwen Sun Xiaochao Ma Chenhui Hu Stamp stress analysis with low temperature nanoimprint lithography Functional Materials |
| description |
High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samples do not sustain high temperature. However, LTNIL need to optimize the press parameters in order to fully transfer patterns. Finite Element Method (FEM) is an excellent approach to examine the filling process. The stamp stress was simulated from four points of view, imprint pressure, imprint temperature, stamp pattern and stamp material. It was found that the stress in the stamp corners is especially bigger than other areas, the stress increases with the stamps aspect ratio increases, and stress distribution is more uniform for dense pattern stamp. |
| format |
Article |
| author |
Hongwen Sun Xiaochao Ma Chenhui Hu |
| author_facet |
Hongwen Sun Xiaochao Ma Chenhui Hu |
| author_sort |
Hongwen Sun |
| title |
Stamp stress analysis with low temperature nanoimprint lithography |
| title_short |
Stamp stress analysis with low temperature nanoimprint lithography |
| title_full |
Stamp stress analysis with low temperature nanoimprint lithography |
| title_fullStr |
Stamp stress analysis with low temperature nanoimprint lithography |
| title_full_unstemmed |
Stamp stress analysis with low temperature nanoimprint lithography |
| title_sort |
stamp stress analysis with low temperature nanoimprint lithography |
| publisher |
НТК «Інститут монокристалів» НАН України |
| publishDate |
2016 |
| topic_facet |
Technology |
| url |
http://dspace.nbuv.gov.ua/handle/123456789/121489 |
| citation_txt |
Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. |
| series |
Functional Materials |
| work_keys_str_mv |
AT hongwensun stampstressanalysiswithlowtemperaturenanoimprintlithography AT xiaochaoma stampstressanalysiswithlowtemperaturenanoimprintlithography AT chenhuihu stampstressanalysiswithlowtemperaturenanoimprintlithography |
| first_indexed |
2023-10-18T20:39:40Z |
| last_indexed |
2023-10-18T20:39:40Z |
| _version_ |
1796150780153036800 |