2025-02-23T03:14:16-05:00 DEBUG: VuFindSearch\Backend\Solr\Connector: Query fl=%2A&wt=json&json.nl=arrarr&q=id%3A%22irk-123456789-133228%22&qt=morelikethis&rows=5
2025-02-23T03:14:16-05:00 DEBUG: VuFindSearch\Backend\Solr\Connector: => GET http://localhost:8983/solr/biblio/select?fl=%2A&wt=json&json.nl=arrarr&q=id%3A%22irk-123456789-133228%22&qt=morelikethis&rows=5
2025-02-23T03:14:16-05:00 DEBUG: VuFindSearch\Backend\Solr\Connector: <= 200 OK
2025-02-23T03:14:16-05:00 DEBUG: Deserialized SOLR response
Technology options for embedding low-profile electronic components in printed circuit boards
In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2018
|
| Series: | Технология и конструирование в электронной аппаратуре |
| Subjects: | |
| Online Access: | http://dspace.nbuv.gov.ua/handle/123456789/133228 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|