The correlation between film structure and surface temperature

• Дата: 2009
• Автори: Shaginyan, L.R., Belousov, I.V., Sedlyar, A.G.
• Формат: Стаття
• Мова: English
• Опубліковано: НТК «Інститут монокристалів» НАН України 2009
• Назва видання: Functional Materials
• Теми: Characterization and properties
• Онлайн доступ: http://dspace.nbuv.gov.ua/handle/123456789/138930
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Цитувати: The correlation between film structure and surface temperature // L.R. Shaginyan, I.V. Belousov, A.G. Sedlyar // Functional Materials. — 2009. — Т. 16, № 4. — С. 384-389. — Бібліогр.: 11 назв. — англ.

The structure of metal films deposited from fluxes of energetic and thermalized sputtered atoms has been studied in detail. The growth surface temperature Tsurf developing during the condensation of sputtered atoms has been measured by two independent techniques. Variations in the film structure from fine-grained in the interface region to coarse-grained in the upper part of the film correlate with variations in the Tsurf. The Tsurf being equal to the substrate temperature at the beginning of the deposition steeply increases and remains several times higher than the substrate temperature during the process. We explain this effect by formation of a liquid-like layerwith low thermal conductivity that forms on the growth surface during deposition. Due to this layer we assert that the film grows by a "gas->liquid->solid" rather than a "gas->solid" mechanism independently on the deposition method.