Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices
The steady-state linear thermal conductivity problem for an isotropic layer
 with a thin foreign parallelepipedic inclusion that releases heat has been considered with
 account of heat dissipation. The methodology for analytic solution of three-dimensional
 steady-state bound...
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| Published in: | Semiconductor Physics Quantum Electronics & Optoelectronics |
|---|---|
| Date: | 2011 |
| Main Author: | |
| Format: | Article |
| Language: | English |
| Published: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2011
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| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/117800 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices / V.I. Gavrysh // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2011. — Т. 14, № 4. — С. 478-481. — Бібліогр.: 7 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| _version_ | 1862648430607728640 |
|---|---|
| author | Gavrysh, V.I. |
| author_facet | Gavrysh, V.I. |
| citation_txt | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices / V.I. Gavrysh // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2011. — Т. 14, № 4. — С. 478-481. — Бібліогр.: 7 назв. — англ. |
| collection | DSpace DC |
| container_title | Semiconductor Physics Quantum Electronics & Optoelectronics |
| description | The steady-state linear thermal conductivity problem for an isotropic layer
with a thin foreign parallelepipedic inclusion that releases heat has been considered with
account of heat dissipation. The methodology for analytic solution of three-dimensional
steady-state boundary thermal conductivity problem has been suggested.
|
| first_indexed | 2025-12-01T14:44:56Z |
| format | Article |
| fulltext | |
| id | nasplib_isofts_kiev_ua-123456789-117800 |
| institution | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| issn | 1560-8034 |
| language | English |
| last_indexed | 2025-12-01T14:44:56Z |
| publishDate | 2011 |
| publisher | Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
| record_format | dspace |
| spelling | Gavrysh, V.I. 2017-05-26T17:50:49Z 2017-05-26T17:50:49Z 2011 Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices / V.I. Gavrysh // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2011. — Т. 14, № 4. — С. 478-481. — Бібліогр.: 7 назв. — англ. 1560-8034 PACS 74.25.fc https://nasplib.isofts.kiev.ua/handle/123456789/117800 The steady-state linear thermal conductivity problem for an isotropic layer
 with a thin foreign parallelepipedic inclusion that releases heat has been considered with
 account of heat dissipation. The methodology for analytic solution of three-dimensional
 steady-state boundary thermal conductivity problem has been suggested. en Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України Semiconductor Physics Quantum Electronics & Optoelectronics Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices Article published earlier |
| spellingShingle | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices Gavrysh, V.I. |
| title | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| title_full | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| title_fullStr | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| title_full_unstemmed | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| title_short | Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| title_sort | modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices |
| url | https://nasplib.isofts.kiev.ua/handle/123456789/117800 |
| work_keys_str_mv | AT gavryshvi modellingthetemperatureconditionsinthreedimensionalpiecewisehomogeneouselementsformicroelectronicdevices |