Tin doping effect on crystallization of amorphous silicon obtained by vapor deposition in vacuum

The influence of tin impurity on amorphous silicon crystallization was
 investigated using the methods of Raman scattering, Auger spectroscopy at ion etching,
 scanning electron microscopy and X-ray fluorescence microanalysis in thin films of
 Si:Sn alloy manufactured by ther...

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Veröffentlicht in:Semiconductor Physics Quantum Electronics & Optoelectronics
Datum:2013
Hauptverfasser: Neimash, V.B., Poroshin, V.M., Shepeliavyi, P.Ye., Yukhymchuk, V.O., Melnyk, V.V., Makara, M.A., Kuzmich, A.G.
Format: Artikel
Sprache:Englisch
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2013
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/117819
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Tin doping effect on crystallization of amorphous silicon
 obtained by vapor deposition in vacuum / V.B. Neimash, V.M. Poroshin, P.Ye. Shepeliavyi, V.O. Yukhymchuk, V.V. Melnyk, V.A. Makara, A.G. Kuzmich // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 4. — С. 331-335. — Бібліогр.: 16 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
Beschreibung
Zusammenfassung:The influence of tin impurity on amorphous silicon crystallization was
 investigated using the methods of Raman scattering, Auger spectroscopy at ion etching,
 scanning electron microscopy and X-ray fluorescence microanalysis in thin films of
 Si:Sn alloy manufactured by thermal evaporation. Formation of Si crystals of the 2 to 4-
 nm size has been found in the amorphous matrix alloy formed at the temperature 300 C.
 Total volume of nanocrystals correlates with the content of tin and can comprise as much
 as 80% of the film. The effect of tin-induced crystallization of amorphous silicon
 occurred only if there are clusters of metallic tin in the amorphous matrix. The
 mechanism of tin-induced crystallization of silicon that has been proposed takes into
 account the processes in eutectic layer at the interface metal tin – amorphous silicon.
ISSN:1560-8034