Properties of junction diodes under conditions of bisotropic strains

In consideration of influence of technological strains on characteristics of
 junction diodes located on surface of silicon wafers, biaxial character of such strains has
 taken into account. The cases of (001)- and (111)-oriented silicon wafers on whose
 surface the diodes ar...

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Збережено в:
Бібліографічні деталі
Опубліковано в: :Semiconductor Physics Quantum Electronics & Optoelectronics
Дата:2009
Автор: Borblik, V.L.
Формат: Стаття
Мова:Англійська
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2009
Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/118608
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Properties of junction diodes under conditions
 of bisotropic strains / V.L. Borblik // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 1. — С. 42-46. — Бібліогр.: 20 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
Опис
Резюме:In consideration of influence of technological strains on characteristics of
 junction diodes located on surface of silicon wafers, biaxial character of such strains has
 taken into account. The cases of (001)- and (111)-oriented silicon wafers on whose
 surface the diodes are located as well as longitudinal (in plane of the wafer) and
 transversal (perpendicular to it) diode current flow have been considered. It is shown that
 at small strains, the diodes located on the surface of (111)-Si are less subjected (as a
 whole) to their influence. Furthermore, the change in the intrinsic carrier concentration
 has been assessed in (001)-Si at very large bisotropic strains. The concentration is shown
 to increase by several orders of magnitude irrespective of the strain sign.
ISSN:1560-8034