Reliability of AC thick-film electroluminescent lamps

The reliability of AC thick-film EL devices has been studied. The AC thickfilm
 EL devices were fabricated by Novatech Inc. using the industrial print screen
 technology. The analysis of reasons for failure has been proposed. The dependence of EL
 lamp parameters on physical...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:2009
Main Authors: Vlaskin, V., Vlaskina, S., Berezhinsky, L., Svechnikov, G.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2009
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/118690
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Reliability of AC thick-film electroluminescent lamps / V. Vlaskin, S. Vlaskina, L. Berezhinsky, G. Svyechnikov // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 173-177. — Бібліогр.: 5 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Vlaskin, V.
Vlaskina, S.
Berezhinsky, L.
Svechnikov, G.
author_facet Vlaskin, V.
Vlaskina, S.
Berezhinsky, L.
Svechnikov, G.
citation_txt Reliability of AC thick-film electroluminescent lamps / V. Vlaskin, S. Vlaskina, L. Berezhinsky, G. Svyechnikov // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 173-177. — Бібліогр.: 5 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description The reliability of AC thick-film EL devices has been studied. The AC thickfilm
 EL devices were fabricated by Novatech Inc. using the industrial print screen
 technology. The analysis of reasons for failure has been proposed. The dependence of EL
 lamp parameters on physical properties of the device EL layers was found. Our analysis
 of the breakdown spot showed that improvement of reliability can be reached using the
 additional dielectric layer between the phosphor layer and transparent electrode, high
 concentration of phosphor powder 70 % and binder 30 %, balanced resistance between
 the electric circuit and EL lamp. The thickness of the phosphor layer was equal to H =
 (1 + √3/2)D (hexagonal packing), where D is the mean diameter of phosphor particles.
 The reliability dependence of EL lamp on a water adsorption property of packaging
 material was revealed.
first_indexed 2025-12-01T13:20:13Z
format Article
fulltext
id nasplib_isofts_kiev_ua-123456789-118690
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
issn 1560-8034
language English
last_indexed 2025-12-01T13:20:13Z
publishDate 2009
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Vlaskin, V.
Vlaskina, S.
Berezhinsky, L.
Svechnikov, G.
2017-05-30T19:49:44Z
2017-05-30T19:49:44Z
2009
Reliability of AC thick-film electroluminescent lamps / V. Vlaskin, S. Vlaskina, L. Berezhinsky, G. Svyechnikov // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 173-177. — Бібліогр.: 5 назв. — англ.
1560-8034
PACS 78.60.Fi
https://nasplib.isofts.kiev.ua/handle/123456789/118690
The reliability of AC thick-film EL devices has been studied. The AC thickfilm
 EL devices were fabricated by Novatech Inc. using the industrial print screen
 technology. The analysis of reasons for failure has been proposed. The dependence of EL
 lamp parameters on physical properties of the device EL layers was found. Our analysis
 of the breakdown spot showed that improvement of reliability can be reached using the
 additional dielectric layer between the phosphor layer and transparent electrode, high
 concentration of phosphor powder 70 % and binder 30 %, balanced resistance between
 the electric circuit and EL lamp. The thickness of the phosphor layer was equal to H =
 (1 + √3/2)D (hexagonal packing), where D is the mean diameter of phosphor particles.
 The reliability dependence of EL lamp on a water adsorption property of packaging
 material was revealed.
This work was supported by Research Development
 center of the EL-Korea Corporation and the Novatech Inc.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Reliability of AC thick-film electroluminescent lamps
Article
published earlier
spellingShingle Reliability of AC thick-film electroluminescent lamps
Vlaskin, V.
Vlaskina, S.
Berezhinsky, L.
Svechnikov, G.
title Reliability of AC thick-film electroluminescent lamps
title_full Reliability of AC thick-film electroluminescent lamps
title_fullStr Reliability of AC thick-film electroluminescent lamps
title_full_unstemmed Reliability of AC thick-film electroluminescent lamps
title_short Reliability of AC thick-film electroluminescent lamps
title_sort reliability of ac thick-film electroluminescent lamps
url https://nasplib.isofts.kiev.ua/handle/123456789/118690
work_keys_str_mv AT vlaskinv reliabilityofacthickfilmelectroluminescentlamps
AT vlaskinas reliabilityofacthickfilmelectroluminescentlamps
AT berezhinskyl reliabilityofacthickfilmelectroluminescentlamps
AT svechnikovg reliabilityofacthickfilmelectroluminescentlamps