Thermal simulation of heterogeneous structural components in microelectronic devices

The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-...

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Опубліковано в: :Semiconductor Physics Quantum Electronics & Optoelectronics
Дата:2010
Автори: Gavrysh, V.I., Fedasyuk, D.V.
Формат: Стаття
Мова:English
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/118738
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-118738
record_format dspace
spelling Gavrysh, V.I.
Fedasyuk, D.V.
2017-05-31T05:34:02Z
2017-05-31T05:34:02Z
2010
Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.
1560-8034
PACS 74.25.fc
https://nasplib.isofts.kiev.ua/handle/123456789/118738
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Thermal simulation of heterogeneous structural components in microelectronic devices
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Thermal simulation of heterogeneous structural components in microelectronic devices
spellingShingle Thermal simulation of heterogeneous structural components in microelectronic devices
Gavrysh, V.I.
Fedasyuk, D.V.
title_short Thermal simulation of heterogeneous structural components in microelectronic devices
title_full Thermal simulation of heterogeneous structural components in microelectronic devices
title_fullStr Thermal simulation of heterogeneous structural components in microelectronic devices
title_full_unstemmed Thermal simulation of heterogeneous structural components in microelectronic devices
title_sort thermal simulation of heterogeneous structural components in microelectronic devices
author Gavrysh, V.I.
Fedasyuk, D.V.
author_facet Gavrysh, V.I.
Fedasyuk, D.V.
publishDate 2010
language English
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
format Article
description The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered.
issn 1560-8034
url https://nasplib.isofts.kiev.ua/handle/123456789/118738
citation_txt Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.
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