Thermal simulation of heterogeneous structural components in microelectronic devices
The steady state nonlinear problem of thermal conduction for isotropic strip
 with foreign rectangular inclusion that heats as an internal thermal source with heat
 dissipation has been considered. The methodology to solve this problem and its
 application for the specific de...
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| Veröffentlicht in: | Semiconductor Physics Quantum Electronics & Optoelectronics |
|---|---|
| Datum: | 2010 |
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Englisch |
| Veröffentlicht: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2010
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| Online Zugang: | https://nasplib.isofts.kiev.ua/handle/123456789/118738 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Thermal simulation of heterogeneous structural components
 in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| _version_ | 1862700106653892608 |
|---|---|
| author | Gavrysh, V.I. Fedasyuk, D.V. |
| author_facet | Gavrysh, V.I. Fedasyuk, D.V. |
| citation_txt | Thermal simulation of heterogeneous structural components
 in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
| collection | DSpace DC |
| container_title | Semiconductor Physics Quantum Electronics & Optoelectronics |
| description | The steady state nonlinear problem of thermal conduction for isotropic strip
with foreign rectangular inclusion that heats as an internal thermal source with heat
dissipation has been considered. The methodology to solve this problem and its
application for the specific dependence of the thermal-conductivity coefficients on
temperature has been offered.
|
| first_indexed | 2025-12-07T16:37:52Z |
| format | Article |
| fulltext | |
| id | nasplib_isofts_kiev_ua-123456789-118738 |
| institution | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| issn | 1560-8034 |
| language | English |
| last_indexed | 2025-12-07T16:37:52Z |
| publishDate | 2010 |
| publisher | Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
| record_format | dspace |
| spelling | Gavrysh, V.I. Fedasyuk, D.V. 2017-05-31T05:34:02Z 2017-05-31T05:34:02Z 2010 Thermal simulation of heterogeneous structural components
 in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. 1560-8034 PACS 74.25.fc https://nasplib.isofts.kiev.ua/handle/123456789/118738 The steady state nonlinear problem of thermal conduction for isotropic strip
 with foreign rectangular inclusion that heats as an internal thermal source with heat
 dissipation has been considered. The methodology to solve this problem and its
 application for the specific dependence of the thermal-conductivity coefficients on
 temperature has been offered. en Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України Semiconductor Physics Quantum Electronics & Optoelectronics Thermal simulation of heterogeneous structural components in microelectronic devices Article published earlier |
| spellingShingle | Thermal simulation of heterogeneous structural components in microelectronic devices Gavrysh, V.I. Fedasyuk, D.V. |
| title | Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_full | Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_fullStr | Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_full_unstemmed | Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_short | Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_sort | thermal simulation of heterogeneous structural components in microelectronic devices |
| url | https://nasplib.isofts.kiev.ua/handle/123456789/118738 |
| work_keys_str_mv | AT gavryshvi thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices AT fedasyukdv thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices |