Thermal simulation of heterogeneous structural components in microelectronic devices
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-...
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| Опубліковано в: : | Semiconductor Physics Quantum Electronics & Optoelectronics |
|---|---|
| Дата: | 2010 |
| Автори: | , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2010
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| Онлайн доступ: | https://nasplib.isofts.kiev.ua/handle/123456789/118738 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
nasplib_isofts_kiev_ua-123456789-118738 |
|---|---|
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dspace |
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Gavrysh, V.I. Fedasyuk, D.V. 2017-05-31T05:34:02Z 2017-05-31T05:34:02Z 2010 Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. 1560-8034 PACS 74.25.fc https://nasplib.isofts.kiev.ua/handle/123456789/118738 The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered. en Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України Semiconductor Physics Quantum Electronics & Optoelectronics Thermal simulation of heterogeneous structural components in microelectronic devices Article published earlier |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| title |
Thermal simulation of heterogeneous structural components in microelectronic devices |
| spellingShingle |
Thermal simulation of heterogeneous structural components in microelectronic devices Gavrysh, V.I. Fedasyuk, D.V. |
| title_short |
Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_full |
Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_fullStr |
Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_full_unstemmed |
Thermal simulation of heterogeneous structural components in microelectronic devices |
| title_sort |
thermal simulation of heterogeneous structural components in microelectronic devices |
| author |
Gavrysh, V.I. Fedasyuk, D.V. |
| author_facet |
Gavrysh, V.I. Fedasyuk, D.V. |
| publishDate |
2010 |
| language |
English |
| container_title |
Semiconductor Physics Quantum Electronics & Optoelectronics |
| publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
| format |
Article |
| description |
The steady state nonlinear problem of thermal conduction for isotropic strip
with foreign rectangular inclusion that heats as an internal thermal source with heat
dissipation has been considered. The methodology to solve this problem and its
application for the specific dependence of the thermal-conductivity coefficients on
temperature has been offered.
|
| issn |
1560-8034 |
| url |
https://nasplib.isofts.kiev.ua/handle/123456789/118738 |
| citation_txt |
Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
| work_keys_str_mv |
AT gavryshvi thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices AT fedasyukdv thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices |
| first_indexed |
2025-12-07T16:37:52Z |
| last_indexed |
2025-12-07T16:37:52Z |
| _version_ |
1850868207627272192 |