Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil
The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determine...
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| Veröffentlicht in: | Functional Materials |
|---|---|
| Datum: | 2015 |
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | English |
| Veröffentlicht: |
НТК «Інститут монокристалів» НАН України
2015
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| Schlagworte: | |
| Online Zugang: | https://nasplib.isofts.kiev.ua/handle/123456789/119359 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil / E.A.Vovk // Functional Materials. — 2015. — Т. 22, № 2. — С. 252-257. — Бібліогр.: 13 назв. — англ. |