Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil

The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determine...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Functional Materials
Datum:2015
ISSN:1027-5495
1. Verfasser: Vovk, E.A.
Format: Artikel
Sprache:Englisch
Veröffentlicht: НТК «Інститут монокристалів» НАН України 2015
Schlagworte:
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/119359
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil / E.A.Vovk // Functional Materials. — 2015. — Т. 22, № 2. — С. 252-257. — Бібліогр.: 13 назв. — англ.

Institution

Digital Library of Periodicals of National Academy of Sciences of Ukraine
Beschreibung
Zusammenfassung:The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determined. It was determined that these conditions depend on the crystallographic orientation of the sapphire surface. Surface roughness Ra 0.2-0.4 nm and the optical quality class 20/10-40/20 (USA MIL O 13830) was obtained for orientations (0001), (11-20), and (10-12) by CMP with the polishing suspension contained the surfactant with OH functional groups, and at optimal value of pH for each orientations.
ISSN:1027-5495