Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil
The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determine...
Збережено в:
| Опубліковано в: : | Functional Materials |
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| Дата: | 2015 |
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| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
НТК «Інститут монокристалів» НАН України
2015
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| Теми: | |
| Онлайн доступ: | https://nasplib.isofts.kiev.ua/handle/123456789/119359 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil / E.A.Vovk // Functional Materials. — 2015. — Т. 22, № 2. — С. 252-257. — Бібліогр.: 13 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| Резюме: | The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determined. It was determined that these conditions depend on the crystallographic orientation of the sapphire surface. Surface roughness Ra 0.2-0.4 nm and the optical quality class 20/10-40/20 (USA MIL O 13830) was obtained for orientations (0001), (11-20), and (10-12) by CMP with the polishing suspension contained the surfactant with OH functional groups, and at optimal value of pH for each orientations.
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| ISSN: | 1027-5495 |