The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices

Two doping methods for introducing phosphorus atoms into polysilicon to form a gate electrode for 0.5 mm CMOS were investigated. These methods were ion implantation and the ”in-situ” one (it is also known as thermal diffusion). For the in-situ method, the concentration of 1.8.10²⁰cm-³ for Si₂H₆ and...

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Veröffentlicht in:Semiconductor Physics Quantum Electronics & Optoelectronics
Datum:2002
Hauptverfasser: Ahmad, I., Omar, A., Mikdad, A.
Format: Artikel
Sprache:English
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2002
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/121185
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices / I. Ahmad, A. Omar, A. Mikdad // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 2. — С. 188-192. — Бібліогр.: 14 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-121185
record_format dspace
spelling Ahmad, I.
Omar, A.
Mikdad, A.
2017-06-13T16:40:43Z
2017-06-13T16:40:43Z
2002
The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices / I. Ahmad, A. Omar, A. Mikdad // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 2. — С. 188-192. — Бібліогр.: 14 назв. — англ.
1560-8034
https://nasplib.isofts.kiev.ua/handle/123456789/121185
Two doping methods for introducing phosphorus atoms into polysilicon to form a gate electrode for 0.5 mm CMOS were investigated. These methods were ion implantation and the ”in-situ” one (it is also known as thermal diffusion). For the in-situ method, the concentration of 1.8.10²⁰cm-³ for Si₂H₆ and phosphane (PH3) were used, in the course of ion implantation applying two different doses: 2.0.10¹⁶ and 3.10¹⁶cm-² at 40 keV. The micromorphology of the polysilicon surface was studied using the atomic force microscopy (AFM). The polysilicon thickness obtained via the in-situ method ranged between 12.35 and 26.08 nm, with an average value thickness of 18.0 nm, and its sheet resistance value was 21±1 ohm/square. As for the ion implantation method, at the lower doses the thickness ranged at about 12.00 upto 46.0 nm with an average value of 24.0 nm, and its sheet resistance values were of 36±13 and 45±21 ohm/square, respectively. At the higher doses, the thickness varied from 12.16 to 47.84 nm with an average meaning 23.96 nm, and its sheet resistance value was between 25 to 40 ohm/square. Therefore, polysilicon doped by the in-situ method has smoother and thinner surface and possesses better electrical properties.
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Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
spellingShingle The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
Ahmad, I.
Omar, A.
Mikdad, A.
title_short The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
title_full The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
title_fullStr The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
title_full_unstemmed The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices
title_sort effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron cmos devices
author Ahmad, I.
Omar, A.
Mikdad, A.
author_facet Ahmad, I.
Omar, A.
Mikdad, A.
publishDate 2002
language English
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
format Article
description Two doping methods for introducing phosphorus atoms into polysilicon to form a gate electrode for 0.5 mm CMOS were investigated. These methods were ion implantation and the ”in-situ” one (it is also known as thermal diffusion). For the in-situ method, the concentration of 1.8.10²⁰cm-³ for Si₂H₆ and phosphane (PH3) were used, in the course of ion implantation applying two different doses: 2.0.10¹⁶ and 3.10¹⁶cm-² at 40 keV. The micromorphology of the polysilicon surface was studied using the atomic force microscopy (AFM). The polysilicon thickness obtained via the in-situ method ranged between 12.35 and 26.08 nm, with an average value thickness of 18.0 nm, and its sheet resistance value was 21±1 ohm/square. As for the ion implantation method, at the lower doses the thickness ranged at about 12.00 upto 46.0 nm with an average value of 24.0 nm, and its sheet resistance values were of 36±13 and 45±21 ohm/square, respectively. At the higher doses, the thickness varied from 12.16 to 47.84 nm with an average meaning 23.96 nm, and its sheet resistance value was between 25 to 40 ohm/square. Therefore, polysilicon doped by the in-situ method has smoother and thinner surface and possesses better electrical properties.
issn 1560-8034
url https://nasplib.isofts.kiev.ua/handle/123456789/121185
citation_txt The effect of doping methods on electrical properties and micromorphology of polysilicon gate electrode in submicron CMOS devices / I. Ahmad, A. Omar, A. Mikdad // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 2. — С. 188-192. — Бібліогр.: 14 назв. — англ.
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