Thermal resistance of PCD materials with borides bonding phase
In these studies, one group of PCD materials was prepared using diamond powder and 10 wt % of TiB₂ and the second batch of the PCD material was prepared using a mixture of diamond powder with 5 wt % of TiB₂ and 2 wt % of Co. The materials have been sintered using a Bridgman-type high-pressure appara...
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| Published in: | Сверхтвердые материалы |
|---|---|
| Date: | 2015 |
| Main Authors: | Jaworska, L., Klimczyk, P., Szutkowska, M., Putyra, P., Sitarz, M., Cygan, S., Rutkowski, P. |
| Format: | Article |
| Language: | English |
| Published: |
Інститут надтвердих матеріалів ім. В.М. Бакуля НАН України
2015
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| Subjects: | |
| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/126167 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Thermal resistance of PCD materials with borides bonding phase / L. Jaworska, P. Klimczyk, M. Szutkowska, P. Putyra, M. Sitarz, S. Cygan, P. Rutkowski // Сверхтвердые материалы. — 2015. — № 3. — С. 17-30. — Бібліогр.: 15 назв. — англ. |
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