Electrodeposition of copper indium diselenide films using pulse plating technique
Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film...
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| Veröffentlicht in: | Functional Materials |
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| Datum: | 2007 |
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Englisch |
| Veröffentlicht: |
НТК «Інститут монокристалів» НАН України
2007
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| Online Zugang: | https://nasplib.isofts.kiev.ua/handle/123456789/136990 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ. |