Electrodeposition of copper indium diselenide films using pulse plating technique

Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film...

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Veröffentlicht in:Functional Materials
Datum:2007
1. Verfasser: Klochko, N.P.
Format: Artikel
Sprache:English
Veröffentlicht: НТК «Інститут монокристалів» НАН України 2007
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/136990
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-136990
record_format dspace
spelling Klochko, N.P.
2018-06-16T18:25:38Z
2018-06-16T18:25:38Z
2007
Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ.
1027-5495
https://nasplib.isofts.kiev.ua/handle/123456789/136990
Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film resistivity measurements.
en
НТК «Інститут монокристалів» НАН України
Functional Materials
Electrodeposition of copper indium diselenide films using pulse plating technique
Електроосадження плівок диселеніду міді та індію в імпульсному режимі
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Electrodeposition of copper indium diselenide films using pulse plating technique
spellingShingle Electrodeposition of copper indium diselenide films using pulse plating technique
Klochko, N.P.
title_short Electrodeposition of copper indium diselenide films using pulse plating technique
title_full Electrodeposition of copper indium diselenide films using pulse plating technique
title_fullStr Electrodeposition of copper indium diselenide films using pulse plating technique
title_full_unstemmed Electrodeposition of copper indium diselenide films using pulse plating technique
title_sort electrodeposition of copper indium diselenide films using pulse plating technique
author Klochko, N.P.
author_facet Klochko, N.P.
publishDate 2007
language English
container_title Functional Materials
publisher НТК «Інститут монокристалів» НАН України
format Article
title_alt Електроосадження плівок диселеніду міді та індію в імпульсному режимі
description Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film resistivity measurements.
issn 1027-5495
url https://nasplib.isofts.kiev.ua/handle/123456789/136990
citation_txt Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ.
work_keys_str_mv AT klochkonp electrodepositionofcopperindiumdiselenidefilmsusingpulseplatingtechnique
AT klochkonp elektroosadžennâplívokdiselenídumídítaíndíûvímpulʹsnomurežimí
first_indexed 2025-12-07T15:28:23Z
last_indexed 2025-12-07T15:28:23Z
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