Electrodeposition of copper indium diselenide films using pulse plating technique
Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film...
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| Veröffentlicht in: | Functional Materials |
|---|---|
| Datum: | 2007 |
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| Format: | Artikel |
| Sprache: | English |
| Veröffentlicht: |
НТК «Інститут монокристалів» НАН України
2007
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| Online Zugang: | https://nasplib.isofts.kiev.ua/handle/123456789/136990 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
nasplib_isofts_kiev_ua-123456789-136990 |
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Klochko, N.P. 2018-06-16T18:25:38Z 2018-06-16T18:25:38Z 2007 Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ. 1027-5495 https://nasplib.isofts.kiev.ua/handle/123456789/136990 Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film resistivity measurements. en НТК «Інститут монокристалів» НАН України Functional Materials Electrodeposition of copper indium diselenide films using pulse plating technique Електроосадження плівок диселеніду міді та індію в імпульсному режимі Article published earlier |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| title |
Electrodeposition of copper indium diselenide films using pulse plating technique |
| spellingShingle |
Electrodeposition of copper indium diselenide films using pulse plating technique Klochko, N.P. |
| title_short |
Electrodeposition of copper indium diselenide films using pulse plating technique |
| title_full |
Electrodeposition of copper indium diselenide films using pulse plating technique |
| title_fullStr |
Electrodeposition of copper indium diselenide films using pulse plating technique |
| title_full_unstemmed |
Electrodeposition of copper indium diselenide films using pulse plating technique |
| title_sort |
electrodeposition of copper indium diselenide films using pulse plating technique |
| author |
Klochko, N.P. |
| author_facet |
Klochko, N.P. |
| publishDate |
2007 |
| language |
English |
| container_title |
Functional Materials |
| publisher |
НТК «Інститут монокристалів» НАН України |
| format |
Article |
| title_alt |
Електроосадження плівок диселеніду міді та індію в імпульсному режимі |
| description |
Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film resistivity measurements.
|
| issn |
1027-5495 |
| url |
https://nasplib.isofts.kiev.ua/handle/123456789/136990 |
| citation_txt |
Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ. |
| work_keys_str_mv |
AT klochkonp electrodepositionofcopperindiumdiselenidefilmsusingpulseplatingtechnique AT klochkonp elektroosadžennâplívokdiselenídumídítaíndíûvímpulʹsnomurežimí |
| first_indexed |
2025-12-07T15:28:23Z |
| last_indexed |
2025-12-07T15:28:23Z |
| _version_ |
1850863836065693696 |