Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin

• Veröffentlicht in: Металлофизика и новейшие технологии
• Datum: 2018
• Hauptverfasser: Morozovych, V.V., Honda, A.R., Lyashenko, Yu.O., Korol, Ya.D., Liashenko, O.Yu., Cserhát, С., Gusak, A.M.
• Format: Artikel
• Sprache: English
• Veröffentlicht: Інститут металофізики ім. Г.В. Курдюмова НАН України 2018
• Schlagworte: Дефекты кристаллической решётки
• Online Zugang: https://nasplib.isofts.kiev.ua/handle/123456789/167717
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Zitieren: Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin / V.V. Morozovych, A.R. Honda, Yu.O. Lyashenko, Ya.D. Korol, O.Yu. Liashenko, С. Cserhát, A.M. Gusak // Металлофизика и новейшие технологии. — 2018. — Т. 40, № 12. — С. 1649-1673. — Бібліогр.: 31 назв. — англ.

The solid-phase reactions of copper with tin are considered, and the porosity of the reaction products depending on the pretreatment of the copper substrate is investigated. Copper substrates for the reaction are prepared by electrodeposition of copper layers with thickness of up to 100 microns on t...