Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing
Studied experimentally in this work has been the process of smoothing relief roughness on the GaAs wafer surface by using the method of contactless nonabrasive chemical-and-mechanical polishing under conditions of its rotational movement relatively to the polishing plate. The model of this process h...
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| Published in: | Semiconductor Physics Quantum Electronics & Optoelectronics |
|---|---|
| Date: | 2017 |
| Main Authors: | Fomin, A.V., Pashchenko, G.A., Kravetskyi, M.Yu., Lutsyshyn, I.G. |
| Format: | Article |
| Language: | English |
| Published: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2017
|
| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/214904 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing / A.V. Fomin, G.A. Pashchenko, M.Yu. Kravetskyi, I.G. Lutsyshyn // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2017. — Т. 20, № 1. — С. 118-122. — Бібліогр.: 3 назв. — англ. |
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