Modeling of information recording and selective etching processes in inorganic resists

Theoretical consideration and computer modeling of information pit recording and etching processes in chalcogenide vitreous semiconductors are proposed, namely we demonstrate how to record and develop information pits with the necessary shape and sizes in the inorganic resist using focused Gaussian...

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Published in:Реєстрація, зберігання і обробка даних
Date:2005
Main Authors: Morozovska, A.N., Kostyukevych, S.A.
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Language:English
Published: Інститут проблем реєстрації інформації НАН України 2005
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Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/50773
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Modeling of information recording and selective etching processes in inorganic resists / A.N. Morozovska, S.A. Kostyukevych // Реєстрація, зберігання і оброб. даних. — 2005. — Т. 7, № 3. — С. 3-16. — Бібліогр.: 13 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Morozovska, A.N.
Kostyukevych, S.A.
author_facet Morozovska, A.N.
Kostyukevych, S.A.
citation_txt Modeling of information recording and selective etching processes in inorganic resists / A.N. Morozovska, S.A. Kostyukevych // Реєстрація, зберігання і оброб. даних. — 2005. — Т. 7, № 3. — С. 3-16. — Бібліогр.: 13 назв. — англ.
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container_title Реєстрація, зберігання і обробка даних
description Theoretical consideration and computer modeling of information pit recording and etching processes in chalcogenide vitreous semiconductors are proposed, namely we demonstrate how to record and develop information pits with the necessary shape and sizes in the inorganic resist using focused Gaussian laser beam and selective etching. It has been shown that phototransformed region cross-section could be almost trapezoidal or parabolic depending on the resist material optical absorption, recording beam power, exposure, etchant selectivity and etching time. Namely, during the laser illumination and thermal heating caused by it, photosensitive material is the quasi-equilibrium microscopic mixture of the transformed and nontransformed phases with different optical absorption coefficients: temperature dependent near the absorption edge «transformed» coefficient бe and almost independent coefficient α0 . If αe ≤ α0 e after thermal heating, the photo-transformed region «bleaches» and the pit depth increases more rapidly under the following laser power increasing. If αe > α0 , the phototransformed region «darkens» and the pit depth increases sub-linearly or even saturates under the following laser power increasing. Thus, almost parabolic or flattened pits appear when αe ≥ α0, whereas the pits with elongated tops appear when αe << α0. After illumination, the spatial distribution of photo-transformed material fraction was calculated using the Kolmogorov-Awrami equation. Analyzing obtained results, we derived a rather simple approximate analytical expression for the dependence of the phototransformed region width and depth on the recording Gaussian beam power, radius and exposure time. Then the selective etching process was simulated numerically. The obtained results quantitatively describe the characteristics of pits recorded by the Gaussian laser beam in thin layers of As₄₀S₆₀ chalcogenide semiconductor. Our model open possibilities how to select the necessary recording procedure and etching conditions in order to obtain pits with the optimum shape and sizes. Запропоновано теоретичний розгляд та комп’ютерне моделювання процесів запису інформації та селективного травлення в халькогенідних напівпровідниках. Змодульовано процес одержання інформаційних питів необхідної форми та розміру у неорганічному резисті, використовуючи сфокусований гаусівський лазерний пучок та селективне травлення. Показано, що переріз фототрансформованої області змінюється від майже трапецієвидного до параболічного в залежності від коефіцієнта оптичного поглинання, потужності лазерного пучка, експозиції, селективності травника та часу травлення. Просторовий розподіл долі фототрансформованого матеріалу розраховано з рівняння Колмогорова-Аврами. Проаналізовано одержані результати й виведено досить простий наближений аналітичний вираз для залежності ширини та висоти фототрансформованої області від потужності лазерного пучка, його радіусу, часу експонування та селективності травника. Одержані результати добре описують характеристики пітів, записаних у тонких шарах халькогеніду As₄₀S₆₀. Модель відкриває реальну можливість добору умов запису та травлення резисту, необхідних для одержання пітів з оптимальними розмірами. Предложено теоретическое рассмотрение и компьютерное моделирование процессов записи информации и селективного травления в халькогенидных полупроводниках. Смоделирован процесс получения информационных питов необходимой формы и размеров в неорганическом резисте, используя сфокусированный гауссовский лазерный пучок и селективное травление. Показано, что сечение фототрансформированной области может изменяться от практически трапециевидного до параболического в зависимости от коэффициента оптического поглощения, мощности лазерного пучка, экспозиции, селективности травителя и времени травления. Пространственное распределение доли фототрансформированного материала рассчитано из уравнения Колмогорова-Аврами. Проанализированы полученные результаты и выведено достаточно простое приближенное аналитическое выражение для зависимости ширины и высоты фототрансформированной области от мощности лазерного пучка, его радиуса, времени экспонирования и селективности травителя. Полученные результаты хорошо описывают характеристики питов, записанных в тонких слоях халькогенида As₄₀S₆₀. Модель открывает реальную возможность выбора условий записи и травления резиста, необходимых для получения питов с оптимальными размерами.
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fulltext Фізичні основи, принципи і методи реєстрації даних ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 3 UDC 621.315; 592:539.213 A. N. Morozovska, S. A. Kostyukevych V. Lashkaryov Institute of Semiconductor Physics, NAS of Ukraine 41, pr. Nauki, 03028 Kiev, Ukraine morozo@mail.i.com.ua; sekret@spie.org.ua Modeling of information recording and selective etching processes in inorganic resists Theoretical consideration and computer modeling of information pit record- ing and etching processes in chalcogenide vitreous semiconductors are pro- posed, namely we demonstrate how to record and develop information pits with the necessary shape and sizes in the inorganic resist using focused Gaussian laser beam and selective etching. It has been shown that photo- transformed region cross-section could be almost trapezoidal or parabolic depending on the resist material optical absorption, recording beam power, exposure, etchant selectivity and etching time. Namely, during the laser il- lumination and thermal heating caused by it, photosensitive material is the quasi-equilibrium microscopic mixture of the transformed and non- transformed phases with different optical absorption coefficients: tempera- ture dependent near the absorption edge «transformed» coefficient eб and almost independent coefficient 0a . If 0aa £e after thermal heating, the photo-transformed region «bleaches» and the pit depth increases more ra- pidly under the following laser power increasing. If 0aa >e , the photo- transformed region «darkens» and the pit depth increases sub-linearly or even saturates under the following laser power increasing. Thus, almost pa- rabolic or flattened pits appear when 0aa ³e , whereas the pits with elon- gated tops appear when 0aa <<e . After illumination, the spatial distribution of photo-transformed material fraction was calculated using the Kolmogo- rov-Awrami equation. Analyzing obtained results, we derived a rather sim- ple approximate analytical expression for the dependence of the photo- transformed region width and depth on the recording Gaussian beam pow- er, radius and exposure time. Then the selective etching process was simu- lated numerically. The obtained results quantitatively describe the cha- racteristics of pits recorded by the Gaussian laser beam in thin layers of As40S60 chalcogenide semiconductor. Our model open possibilities how to © A. N. Morozovska, S. A. Kostyukevych mailto:morozo@mail.i.com.ua mailto:sekret@spie.org.ua A. N. Morozovska, S. A. Kostyukevych 4 select the necessary recording procedure and etching conditions in order to obtain pits with the optimum shape and sizes. Key words: information pits, optical disks, inorganic resist, selective etch- ing. Introduction Laser recording of profiled microstructures are widely used in modern manufactur- ing of optical compact disks (CD) and originals of diffraction elements, synthesized ho- lograms, etc [1]. Numerous experimental and theoretical investigations [2–8] devoted to the information recording and reading by optical methods has already been performed. Despite numerous achievements, a great amount of different problems concerning rec- orded information quality and its density increase still remains unsolved. It was shown [8–12], that using the inorganic resists based on As40S60 chalcogenide glass allows to obtain the profiled structures with sizes much smaller than the diameter of the recording focused laser beam at the wavelengths nm. )532436( ¸=л This paper is devoted to the theoretical consideration of the question how to record pits with the necessary depth profile in photosensitive materials by varying their activa- tion energy, optical absorption, recording Gaussian beam power and exposure as well as the etchant selectivity and etching time. We used the following assumption: the change of thin film structure and temperature caused by a laser beam is the main factor that de- termines the photo-thermo-transformed material amount. We assume that in the course of illumination photosensitive material is quasi-equilibrium microscopic mixture of the transformed and non-transformed phases with relative fractions M and (1 – M) respec- tively. These phases have different photo-chemical properties and the optical absorption coefficients ea and 0a [6]. The approximate formula for the photo-thermo-transformed region that determines the profile parameters (width and height) of the pit has been ob- tained. It has been shown, that pit profile depending on photosensitive material parame- ters, recording beam power, exposure and etching conditions could be flat with rounded edges or parabolic (see Sch. 1). Sch. 1. The photo-thermo-transformed region shape, i.e. ),( zrM spatial distribution calculated at sufficiently small (plot a) and high (plot b) beam exposures X Y X Y b a Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 5 Fundamental equations When the intensive focused laser beam illuminates the photosensitive layer, the optical absorption in the layer l<< z0 is described by the Bouguer-Lambert-Beer law: ( ) ( ) .0,0 ,,,,),,,(,,, Httz tzyxItzyx z tzyxI ££³ -= ¶ ¶ a (1а) Here ),0,,( tyxI is the intensity of the laser beam focused onto the surface 0=z . In ac- cordance with the adopted assumption [6], the light absorption coefficient a is as fol- lows: ( ) ),,,(),,,(1),,,( 0 tzyxMtzyxMtzyx e ×+-= aaa . (1b) It is obvious, that a depends on the exposing beam wavelength l , intensity, tempera- ture and exposure time Ht owing to its dependence on M. The system (1) can be rewrit- ten using the light transmission coefficient b, namely: ( ) ),,(),(,,, 0 tyxIzMtzyxI ×= b , (2a) ( ) ( ) ú ú û ù ê ê ë é ×--×-= ò z dtyxMzztzyxM e 0 ),,,(exp),,,,( 00 xxaaab . (2b) Here ( ) ),0,,(,,0 tyxItyxI = is the incident laser beam intensity, 1),,,(0 << tzyxM and eaa <0 . Let us consider the model situation when the axial-symmetrical Gaussian laser beam moves along Y-axis at the distance d with the constant velocity J . The full expo- sure ),,( zyxH could be calculated directly from (11) and (2), namely: ( ) ( ) ò ÷÷ ø ö çç è æ -+ -×= Ht m tyxIztzyxMdtzyxH 0 2 0 22 exp),,,,(),,( r J b . (3) Here Im is the recording beam maximum intensity, b is the light transmission coefficient (2b), 0r is the recording beam characteristic radius, Ht is the exposure time. The inte- gration in (3) could be performed exactly when 1=b , i.e. at z = 0 [7]. If only 10 >>rd and 00 rr -<< dy , )0,,( yxH profile almost coincides with the intensity profile in X-direction. Thus, one obtains that ÷÷ ø ö çç è æ -» 2 0 2 0 exp)0,,( rJ rp xIyxH m . (4) A. N. Morozovska, S. A. Kostyukevych 6 One can obtain from (4) that the exposure spatial distribution is Gaussian. We assume that the distribution of the photoresist temperature ),,,( tzyxT is determined by the light absorption [3, 9]. Dissipation of the thermal flux during the laser pulse time tH could be neglected, if the characteristic penetration depth of the thermal flux HT t~c is higher than the film thickness l . In this case, the stationary temperature distribution exists [7], namely: B a P k E I tzyxItzyxTtzyxTTtzyxT ),,,(),,,(),,,,(),,,( 0 =DD+» . (5) aE is the activation energy. The function PI formally introduced in (5) has the mean- ing of some characteristic intensity, any increase above which can provide registration of sizable amounts of photo-transformed material in our recording conditions. The fraction of photo-transformed material M could be calculated using the Kol- mogorov-Awrami equation [1, 3, 7]. Allowing for (2) and (5) ),,,( tzyxI and ),,,( tzyxT depend on M(x, y, z, t), and so the fraction should be determined from the Kolmogorov-Awrami equation in a self-consistent manner, namely: ( ) ( ) ÷÷ ÷ ÷ ÷ ø ö çç ç ç ç è æ ÷ ÷ ÷ ÷ ø ö ç ç ç ç è æ + -×-- -» ò H Pa BPm t zM I yxI E Tk zM I yxId tzyxM 0 ),( ),,( 1exp),( ),,( exp 1),,,( 00 0 tb t tb t t t . (6) The characteristic time mt depends not only on properties of recording medium but also on the recording light wavelength l . One immediately obtains from (4) and (6) that the total fraction ),,,(),(0 HtzyxMzxM º of photo-thermo-transformed region cross- section could be estimated by the iteration method starting from the point z = 0: .)0,(1))0,((,exp)0,( , ))0,(( exp)0,(exp1),0,( 02 0 2 0 0 ÷÷ ø ö çç è æ +=÷÷ ø ö çç è æ -= ÷ ÷ ø ö ç ç è æ ÷÷ ø ö çç è æ ---»= T m B a m H xHTxHTxHxH xHTk E H xHHzxM r (7) Here the characteristic exposures PmIH t=0 , ( ) HpaBT tIETkH 0= and the maximum exposure ( ) Hmm tIH Jrp 0» are introduced. Characteristic exposure TH is inversely proportional to the activation energy. It is noteworthy, that at 0HH T << significant thermal heating occurs even at small exposures 0HH m < , and as a result visible struc- tural transformations ( 5,0~0M ) inside the exposed region start at 0HH m < (see the Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 7 light-blue curve in Fig. 1). In contrast to this, at 0HH T >> no thermal heating occurs at exposures Tm HH < and visible structural transformations inside the exposed region starts only at 0HH m >> (see the violet curve in Fig. 1). The intermediate case is rea- lized at 0~ HH T , when at small exposures pm HH < only weak photo-structural trans- formations take place, then at pm HH ³ thermal heating occurs (see the dark-blue curve at Pm HHH >0 in Fig. 1). Fig. 1. Fraction ),0,0(0 mHM from (7) vs. the exposure 0HH m , at 50 =TkE Ba and different 0HH T ratios: 0.1 (light-blue), 1 (dark-blue), 5 (violet) Thus, for the majority of photosensitive materials the conditions Tm HH < and 0HH T > determine the cases of photo-transformations with a weak sub-linear or linear dependence of mm HHM ~),0,0(0 . This case is realized in laser lithography with wide homogeneous beams and holographic grating recording. Whereas the conditions Tm HH ³ and 0HH T < determine the cases of photo-thermo-transformations realized in CD recording by a focused laser beam. Using (7) as a starting point, one obtains from (2b), (6) and (7) the expression for 0M in the first approximation over the parameter ( ) 00 aaa -e : ( )( ) )0,,()0,,(exp),,( 00000 yxMzyxMzzyxM e ×××--×-» aaa . (8) As it follows from (8), if 0aa £e after the thermal heating, the exposed region «bleaches», and the pit depth increases more rapidly under the following laser power 0 2 4 6 8 0 0,2 0,4 0,6 0,8 1 HT/H0 = 0,1 HT/H0 = 1 HT/H0 = 5 Fr ac tio n M 0(0 ,0 ,H m ) HP Exposure Hm/H0, rel. units A. N. Morozovska, S. A. Kostyukevych 8 increasing. If 0aa >e , the exposed region «darkens» and the pit depth increases sub- linearly or even saturates under the following laser power increasing. Thus, almost pa- rabolic or flattened exposed region could appear when 0aa ³e , whereas the pits with elongated tops appear when 0aa <<e . The experimental possibilities of photoresist etching in definite selective etchant are characterized by the etching rates: nJ of non-exposed regions with 0®M and eJ for the exposed ones with 1®M . Similarly to the model (1b) used for absorption coef- ficient a, the etching rate ( )zx,J in the point with the relative fraction ),,(0 zHxM m has the form: ( ) ),,(),,(1),,( 00 memnm HzxMHzxMzHx ×+-= JJJ . (9) After selective etching with time tE, the exposed layer depth profile ),,( Etyxz can be determined using (9) as: ( )( ) { } .0,0,1,0,0)0,(,0)0,,( ),,(),,(),,(1 ),,,( 0 00 E memn m ttlzrnyxz trnHzxMHzxM td tzHxrd ££££== ××+-= vr vr v JJ (10) Here 0l is the initial thickness of the photoresist layer, ),,( zyxnr is the etched region external normal. The approximate analytical expression for residual layer height profile can be obtained from (7)–(10) in the case of mainly normal-directed etching at 12 0 2 <rx , when the equation (10) transforms into the scalar differential equation ( ) ( )( )( ) .0)0,,( ,),(),0,(exp),0,(),( 0000 = ××-+--+» yxz txzHxMHxM td txzd memnen aaaJJJ (11) The equation (11) has the following analytical solution for the etched relief height pro- file: ( )( ) ( ) ( ) ).,0,(),( , ),(exp 1),(exp),0,(1 ln ),( 1),( 000 0 mem nm nmm n e m HxMHx tHx tHxHxM Hx txz ×-+= ÷ ÷ ÷ ø ö ç ç ç è æ + +-÷÷ ø ö çç è æ - = aaaa Ja Ja J J a (12) In the important for applications case of a highly selective positive etchant with 1>>ne JJ and for the exposed region with 1),( £tHx nm Ja , 0aa »e , the expression (12) describing the relief height profile can be approximated as: Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 9 ( ) ),0,(),( 0 mnen HxMtttxz ×-+» JJJ . (13) The expression for ),0,(0 mHxM is given by (7). First, let us consider the region of photo-thermo-transformations with ( ) Tm HH 10~10 ££ , which is used for CD holo- graphic recording and further development in a highly-selective positive etchant with 1>>ne JJ . In this case, the approximation (13) is valid. The dependence of the resi- dual layer thickness on the exposure Hm at the fixed etching time tE is presented in Fig. 2 for different 0HH T ratios. It is clear from the figure that the smaller is 0HH T ra- tio, the more significant is the contribution of thermal transformations and so residual layer thickness decreases more rapidly with the exposure increase. Fig. 2. Residual layer thickness (13) in z0a units vs. the exposure 0HHm after positive selective etching ( nEt Ja 05,0= ) at 50 =TkE Ba , 0aa =e and different 0HHT ratios: 0.1 (light-blue), 1 (dark-blue), 5 (violet) There, let us consider the region of photo-thermo-transformations with 0HH T << . It is easy to obtain that at fixed exposure Hm the residual layer thickness decreases with the etching time increase (see Fig. 3). The residual layer thickness dependence over the exposure Hm at fixed etching time tE is shown in Fig. 4. Various cases can be realized for positive and negative etching, respectively. Photo-thermo-transformed region shapes at fixed exposure 0HH m and increasing selective etching times Et are presented in Fig. 5. It is seen that the modulation depth increases with the etching time at the initial stage, then the etched profile «falls down» as a whole. 0 2 4 6 8 -0,5 -0,4 -0,3 -0,2 -0,1 0 HT/H0 = 0,1 HT/H0 = 1 HT/H0 = 5 La ye r t hi ck ne ss , a 0z Exposure Hm/H0, rel. units unexposed region x®¥ Positive etching Je/Jn= 10 A. N. Morozovska, S. A. Kostyukevych 10 Photo-thermo-transformed region shapes at the fixed selective etching time Et and different exposures 0HH m are presented in Fig. 6. It is seen that the modulation depth increases with the exposure, while the profile becomes more trapezoidal. Thus, almost parabolic or flattened pits could appear when 0aa ³e , whereas the pits with elongated tops appear when 0aa <<e . 0 2 4 6 -5 -4 -3 -2 -1 0 Etching time tE, a.u. Positive etching Je/Jn = 10 unexposed region x®¥ exposed region x®0 La ye r t hi ck ne ss , a 0z 0 2 4 6 8 -5 -4 -3 -2 -1 0 Etching time tE, a.u. Negative etching Jn/Je = 10 La ye r t hi ck ne ss , a 0z unexposed region x®¥ exposed region x®0 Fig. 3. Residual layer thickness (12) in z0a units vs. selective etching time measured in units nJa 0 at fixed exposure 50 =HHm , 0HH T << and 05,0 aa =e (light-blue), 0aa =e (dark-blue), 02aa =e (violet) Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 11 0 2 4 6 8 -2 -1.5 -1 -0.5 Positive etching Je/Jn=10 exposed region x®0 unexposed region x®¥ Exposure Hm/H0, rel. units La ye r t hi ck ne ss , a 0z 0 2 4 6 8 -0.5 -0.4 -0.3 -0.2 -0.1 0 Negative etching Jn/Je=10 unexposed region x®¥ exposed region x®0 Exposure Hm/H0, rel. units La ye r t hi ck ne ss , a 0z Fig. 4. Residual layer thickness (12) in z0a units vs. the exposure 0HH m at fixed selective etching time 5,0=Et measured in units nJa 0 and 0aa =e , 0HHT << (cf. Fig. 2) A. N. Morozovska, S. A. Kostyukevych 12 Fig. 5. Photo-thermo-transformed region shape (12) at the fixed exposure 0HHm and increasing selective etching times Et measured in units nJa 0 , 0aa =e , 0HHT << Fig. 6. Photo-thermo-transformed region shape (12) at the fixed selective etching time Et measured in units nб J0 and different exposures 0HH m , 0aa =e , 0HH T << The characteristics of recorded pits Finally, let us discuss the situation of information recording associated with the la- ser recording on a master disc having a thin chalcogenide layer of As40S60 composition [9–12]. In our recent experiments, the exposure of these thin layers was performed us- ing focused laser light with the wavelength nm,)488...436(=л optical absorption -4 -2 0 2 4 -2 -1.5 -1 -0.5 0 Negative etching Jn/Je=10, Hm/H0 = 2,5 Th ic kn es s, a 0 z tE = 0,1 tE = 0,5 tE = 1 tE = 2 x/r0, rel. units -4 -2 0 2 4 -4 -3 -2 -1 0 Positive etching Je/Jn=10, Hm/H0 = 2,5 x/r0, rel. units Th ic kn es s, a 0 z tE = 2 tE = 1 tE = 0,5 tE = 0,1 -4 -2 0 2 4 -2 -1,5 -1 -0,5 Th ic kn es s, a 0 z Positive etching Je/Jn = 10 unexposed region x®¥ Hm/H0 = 0,1 Hm/H0 = 0,5 Hm/H0 = 2,5 Hm/H0 = 10 tE = 0,5 x/r0, rel. units Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 13 coefficient varied within the range 135 0 cm)103...103( -××»a [4], [13]), beam diame- ter was close to мm8,0 and laser beam power varied from 0,2 to 1 mW. Then the de- velopment of resist in positive selective etchant has been carried out. Under the positive etching, the exposed regions were completely removed, while the unexposed ones re- mained on the substrate. The etching rate of the exposed region is much smaller than that of the unexposed one. So, the profile of the photo-thermo-transformed region after positive selective etching could be determined from (12), (13) in the first approxima- tion. Below, we have presented results for As40S60 thin layers (see Fig. 7, 8, 9). The pit depth zp and halfwidth ap increase with the laser beam power P (see Fig. 8). Starting from a definite laser power PP HP ~ (see Fig. 1), thermal transformations play an important role in the structural transformations inside the exposed spot. We obtained that for the examined As40S60 layer mW 1,0»PP , mW 7,0»TP ( tPH TT » , PtH m » ). As it follows from both our theoretical calculations (13) and experiments, the pit height zp increases linearly with P in the region Tp PPP << , then saturates under further P growth. The pit halfwidth ap gradually increases with the laser beam power P. Fig. 7. Dependence of the exposed pit bottom (triangles, nm) and unexposed disk surface (squares, nm) vs. the etching time tE for As40S60 layer (l = 457 nm, h0 = 305 nm, positive etching, laser power P = 0,46 mW). Solid lines are our fitting (12) at s/nm 85,1 ,s/nm 18 =J=J ne , 50 =HH m and 15 0 cm10 -»б , 02ббe » Using atomic force microscopy (AFM), we examined the obtained microstructures. At the chosen beam power region and exposure time, the cross-section of the photo- thermo-transformed region is close to parabolic at small beam powers mW5,0£P (see Fig. 9), whereas it flattens at higher laser powers [10–12]. The small discrepancy be- tween the pit cross-section obtained using AFM (black curve) and the calculated one 0 30 60 90 120 150 50 100 150 200 250 300 Etching time tE , s. unexposed layer, nm – Pit bottom bP, nm – R es id ua l t hi ck ne ss , n m A. N. Morozovska, S. A. Kostyukevych 14 (blue curve) could be caused by the radial etching components neglected in our model (12). It is clear, that the proposed model describes adequately the available experimental data [8]. 0 0,2 0,4 0 ,6 0 ,8 100 400 500 600 etching tim e 3 0s — , etch ing tim e 45s — Laser po w er P , m W FW H M a p, nm 0,2 0,4 0,6 0,8 50 150 200 etching time 30s – etching time 45s – Laser power P , mW PP 0 D ep th z p , n m Fig. 8. Pit depth and halfwidth FWHM vs. the Gaussian beam power for As40S60 layer ( nm 457=л , nm 3050 =h , etching time 30s (black triangles and squares) and 45s (grey triangles and squares)). Solid curves are our fitting (13) and (10) at 9,10 =TkE Ba , mW 7,0=TP , s/nm 85,1,s/nm 18 =J=J ne (other parameters are the same as in Fig. 7) Modeling of information recording and selective etching processes in inorganic resists ISSN 1560-9189 Реєстрація, зберігання і обробка даних, 2005, Т. 7, № 3 15 ap = 249 nm, zp = 98 nm ap zp Fig. 9. Cross-section of the cavity developed using positive etching of As40S60 layer ( nm 457=л , etching time 45 s, beam power 0,46 mW). The blue line is our fitting calculated in accordance with expression (12) at 10 =HH m , 0ббe = , 10 =HHT Conclusion The rather simple analytical expressions (12), (13) for the pit height profile have been derived. In the most important for CD recording case of photo-thermo- transformations pits halfwidth and height are determined by the beam power, exposure, radius 0r , optical absorption coefficients 0,ea , etching time and rate known for the re- cording material. The proposed model quantitatively describes the characteristics of pits recorded by a Gaussian laser beam in the thin chalcogenide layers of As40S60 composi- tion [7, 8]. Evolved approach allows to select the necessary recording conditions in order to obtain the pits with the optimum shape after positive selective etching of the chalcoge- nide resist, which is useful for applications. Acknowledgements Authors are grateful to Dr A.V. Stronsky, PhD P.E. Shepeliavyi and PhD A.A. Ku- dryavtsev for useful discussions of our model. 1. Оптические диски: история, состояние, перспективы развития / Петров В.В., Крючин A.A., Шанойло С.M., Костюкевич С.A. и др. / Под ред. А.Г.Додонова. — K.: Наук. думка, 2004. — 174 с. 2. Hopkins H.H. and Chung C.S. Influence on the Readout Signal of the Height Profile of the Pits (or Bumps) on Optical Disks // J. Mod. Opt. — 1995. — Vol. 42. — Р. 57–83. 3. Li Y., Mecca C.M.J., Wolf E. Optimum Depth of the Information Pits on the Data Surface of a Compact Disk // J. Mod. Opt. — 2003. — Vol. 50. — Р. 199–206. 4. Gonzalez-Leal J.M., Prieto-Alcon R., Angel J.A., Marquez E. Optical Properties of Thermally Evaporated As40S60–xSex Films // J. Non-Crystalline Solids. — 2003. — Vol. 315. — P. 134–143. A. N. Morozovska, S. A. Kostyukevych 16 5. Handbook of Photographic Science and Engineering. — Published by IS&T (USA), 2000. — 768 р. 6. Kaliteevskaya N.A., Seisyan R.P. Modeling Photochemical Transformations and Photo-Fogging of Photoresist Films Under Action of Pulse Vacuum Ultra-Violet Radiation // Semiconductors Physics and Technics. — 2000. — Vol. 34, № 7. — Р. 857–860. 7. Morozovska A.N., Kostyukevych S.A., Nikitenko L.L., Kryuchin A.A., Kudryavtsev A.A., Shepe- liavyi P.E., Moskalenko N.L. Optical Recording of Information Pits in Thin Layers of Chalcogenide Sem- iconductors // Semiconductor Physics, Quantum Electronics & Optoelectronics. — 2004. — Vol. 7, № 1. — P. 93–100. 8. Kostyukevych S.A., Morozovska A.N. et al. Information Recording in Thin Layers of Chalcoge- nide Semiconductors, Based on the Photoinduced Transformations // Optical Journal. — 2005. — Vol. 72, № 5. — Р. 76–80. 9. Тихонов А.Н., Самарский А.А. Уравнения математической физики. — М.: Наука, 1972. 10. Индутный И.З., Костюкевич С.А., Минько В.И., Стронский А.В., Шепелявый П.Е. Лазер- ная литография в слоях As2S3 // Оптоэлектроника и полупроводниковая техника. — 1993. — № 25. — С. 52–59. 11. Kostyukevych S.A., Indutniy I.Z., Shepeliavyi P.E. Laser Recording in the As2S3 Layers // Data Rec., Storage & Processing. — 1999. — Vol. 1, № 2. — P. 19–24. 12. Kostyukevych S.A., Shepeliavyi P.E., Moskalenko N.L., Vishinskaya A.V., Shanoylo S.M., Boro- din Y.A., Christin V.N. The Optimization of Master Disk recording with As-S-Se Photosensitive Layers // Data Rec., Storage &Processing. — 2002. — Vol. 4, № 2. — P. 3–10. 13. Marquez E., Gonzalez-Leal J.M., Priero-Alcon R., Vlcek M., Stronski A., Wagner T., Minkov D. Optical Characterization of Thermally Evaporated Thin Films of As40S40Se20 Chalcogenide Glass by Ref- lectance Measurements // Appl. Phys. A. — 1998. — Vol. 67. — P. 371–378. Received 22.07.2005 Modeling of information recording and selective etching processes in inorganic resists Introduction Fundamental equations The characteristics of recorded pits Conclusion
id nasplib_isofts_kiev_ua-123456789-50773
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
issn 1560-9189
language English
last_indexed 2025-12-07T17:01:55Z
publishDate 2005
publisher Інститут проблем реєстрації інформації НАН України
record_format dspace
spelling Morozovska, A.N.
Kostyukevych, S.A.
2013-11-02T22:39:59Z
2013-11-02T22:39:59Z
2005
Modeling of information recording and selective etching processes in inorganic resists / A.N. Morozovska, S.A. Kostyukevych // Реєстрація, зберігання і оброб. даних. — 2005. — Т. 7, № 3. — С. 3-16. — Бібліогр.: 13 назв. — англ.
1560-9189
https://nasplib.isofts.kiev.ua/handle/123456789/50773
621.315; 592:539.213
Theoretical consideration and computer modeling of information pit recording and etching processes in chalcogenide vitreous semiconductors are proposed, namely we demonstrate how to record and develop information pits with the necessary shape and sizes in the inorganic resist using focused Gaussian laser beam and selective etching. It has been shown that phototransformed region cross-section could be almost trapezoidal or parabolic depending on the resist material optical absorption, recording beam power, exposure, etchant selectivity and etching time. Namely, during the laser illumination and thermal heating caused by it, photosensitive material is the quasi-equilibrium microscopic mixture of the transformed and nontransformed phases with different optical absorption coefficients: temperature dependent near the absorption edge «transformed» coefficient бe and almost independent coefficient α0 . If αe ≤ α0 e after thermal heating, the photo-transformed region «bleaches» and the pit depth increases more rapidly under the following laser power increasing. If αe > α0 , the phototransformed region «darkens» and the pit depth increases sub-linearly or even saturates under the following laser power increasing. Thus, almost parabolic or flattened pits appear when αe ≥ α0, whereas the pits with elongated tops appear when αe &lt;&lt; α0. After illumination, the spatial distribution of photo-transformed material fraction was calculated using the Kolmogorov-Awrami equation. Analyzing obtained results, we derived a rather simple approximate analytical expression for the dependence of the phototransformed region width and depth on the recording Gaussian beam power, radius and exposure time. Then the selective etching process was simulated numerically. The obtained results quantitatively describe the characteristics of pits recorded by the Gaussian laser beam in thin layers of As₄₀S₆₀ chalcogenide semiconductor. Our model open possibilities how to select the necessary recording procedure and etching conditions in order to obtain pits with the optimum shape and sizes.
Запропоновано теоретичний розгляд та комп’ютерне моделювання процесів запису інформації та селективного травлення в халькогенідних напівпровідниках. Змодульовано процес одержання інформаційних питів необхідної форми та розміру у неорганічному резисті, використовуючи сфокусований гаусівський лазерний пучок та селективне травлення. Показано, що переріз фототрансформованої області змінюється від майже трапецієвидного до параболічного в залежності від коефіцієнта оптичного поглинання, потужності лазерного пучка, експозиції, селективності травника та часу травлення. Просторовий розподіл долі фототрансформованого матеріалу розраховано з рівняння Колмогорова-Аврами. Проаналізовано одержані результати й виведено досить простий наближений аналітичний вираз для залежності ширини та висоти фототрансформованої області від потужності лазерного пучка, його радіусу, часу експонування та селективності травника. Одержані результати добре описують характеристики пітів, записаних у тонких шарах халькогеніду As₄₀S₆₀. Модель відкриває реальну можливість добору умов запису та травлення резисту, необхідних для одержання пітів з оптимальними розмірами.
Предложено теоретическое рассмотрение и компьютерное моделирование процессов записи информации и селективного травления в халькогенидных полупроводниках. Смоделирован процесс получения информационных питов необходимой формы и размеров в неорганическом резисте, используя сфокусированный гауссовский лазерный пучок и селективное травление. Показано, что сечение фототрансформированной области может изменяться от практически трапециевидного до параболического в зависимости от коэффициента оптического поглощения, мощности лазерного пучка, экспозиции, селективности травителя и времени травления. Пространственное распределение доли фототрансформированного материала рассчитано из уравнения Колмогорова-Аврами. Проанализированы полученные результаты и выведено достаточно простое приближенное аналитическое выражение для зависимости ширины и высоты фототрансформированной области от мощности лазерного пучка, его радиуса, времени экспонирования и селективности травителя. Полученные результаты хорошо описывают характеристики питов, записанных в тонких слоях халькогенида As₄₀S₆₀. Модель открывает реальную возможность выбора условий записи и травления резиста, необходимых для получения питов с оптимальными размерами.
Authors are grateful to Dr A.V. Stronsky, PhD P.E. Shepeliavyi and PhD A.A. Kudryavtsev for useful discussions of our model.
en
Інститут проблем реєстрації інформації НАН України
Реєстрація, зберігання і обробка даних
Фізичні основи, принципи та методи реєстрації даних
Modeling of information recording and selective etching processes in inorganic resists
Моделювання процесів запису інформації та селективного травлення в неорганічних резистах
Моделювання процесів запису інформації та селективного травлення в неорганічних резистах
Article
published earlier
spellingShingle Modeling of information recording and selective etching processes in inorganic resists
Morozovska, A.N.
Kostyukevych, S.A.
Фізичні основи, принципи та методи реєстрації даних
title Modeling of information recording and selective etching processes in inorganic resists
title_alt Моделювання процесів запису інформації та селективного травлення в неорганічних резистах
Моделювання процесів запису інформації та селективного травлення в неорганічних резистах
title_full Modeling of information recording and selective etching processes in inorganic resists
title_fullStr Modeling of information recording and selective etching processes in inorganic resists
title_full_unstemmed Modeling of information recording and selective etching processes in inorganic resists
title_short Modeling of information recording and selective etching processes in inorganic resists
title_sort modeling of information recording and selective etching processes in inorganic resists
topic Фізичні основи, принципи та методи реєстрації даних
topic_facet Фізичні основи, принципи та методи реєстрації даних
url https://nasplib.isofts.kiev.ua/handle/123456789/50773
work_keys_str_mv AT morozovskaan modelingofinformationrecordingandselectiveetchingprocessesininorganicresists
AT kostyukevychsa modelingofinformationrecordingandselectiveetchingprocessesininorganicresists
AT morozovskaan modelûvannâprocesívzapisuínformacíítaselektivnogotravlennâvneorganíčnihrezistah
AT kostyukevychsa modelûvannâprocesívzapisuínformacíítaselektivnogotravlennâvneorganíčnihrezistah