Вплив частинок йодиду міді різної дисперсності на ферментативну активність дріжджових клітин Saccharomyces cerevisiae

The effect of different dispersity copper iodide (CuI) particles on vital activity in an aqueous yeast suspension of organisms of the species Saccharomyces cerevisiae under anaerobic conditions under endogenous metabolism was studied by differential microcalorimetry.It has been found that an increas...

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Бібліографічні деталі
Дата:2022
Автори: Bagatskaya, H. M., Mazurenko, R. V., Makhno, S. M., Gorbyk, P. P.
Формат: Стаття
Мова:Українська
Опубліковано: Chuiko Institute of Surface Chemistry National Academy of Sciences of Ukraine 2022
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Онлайн доступ:https://www.cpts.com.ua/index.php/cpts/article/view/619
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Назва журналу:Chemistry, Physics and Technology of Surface

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Chemistry, Physics and Technology of Surface
Опис
Резюме:The effect of different dispersity copper iodide (CuI) particles on vital activity in an aqueous yeast suspension of organisms of the species Saccharomyces cerevisiae under anaerobic conditions under endogenous metabolism was studied by differential microcalorimetry.It has been found that an increase in the concentration of Cu+ to certain values leads to activation of the protective functions of cellular organisms, which is manifested in an increase in the energy costs of the yeast cell on the structural reorganization of the plasmolemma and possibly other membrane structures in order to counter the penetration of the bactericidal agent into the organism and its internal membrane structures. Upon reaching certain concentrations of Cu+, the yeast organism loses its original vitality, so that at its extreme values the organism completely stops its vital activity.The equilibrium concentration of Cu+ ions in aqueous solution for copper iodide nanoparticles is significantly higher in comparison with their microparticles, which is explained by the lower work function of CuI in the solution at the solid-liquid interface due to the increase in the curvature of the surface of the nanoparticle and the change in the surface tension at the interface.