Монтаж микросборок с подложкой из кремния
A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered.
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| Datum: | 2005 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2005
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.2.46 |
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| Назва журналу: | Technology and design in electronic equipment |