Конструкторско-технологические варианты коммутационных плат с подложкой из кремния
The design and technological options of switching boards with a silicon substrate featuring two and three switching levels are considered, based on well-established industrial technologies. The use of these boards ensures the maximum possible packing density of microassemblies at a relatively low pr...
Gespeichert in:
| Datum: | 2005 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2005
|
| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.48 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |