Метод проектирования топологии тонкопленочной микросборки с размерами пленочных элементов 10–50 мкм

The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimen...

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Bibliographic Details
Date:2004
Main Author: Spirin, V. G.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2004
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Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.06
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment

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