Исследование анизотропии теплопроводности деформированных медных пластин
The study shows that copper plates subjected to significant thickness deformations exhibit anisotropy in thermal properties. Based on experimental data on electrical conductivity anisotropy, a fractal model of the structure of deformed metal, and the Wiedemann–Franz law, it is demonstrated that the...
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| Date: | 2004 |
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| Main Authors: | , |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2004
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.51 |
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| Journal Title: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Summary: | The study shows that copper plates subjected to significant thickness deformations exhibit anisotropy in thermal properties. Based on experimental data on electrical conductivity anisotropy, a fractal model of the structure of deformed metal, and the Wiedemann–Franz law, it is demonstrated that the thermal conductivity coefficient of copper sheets after cold rolling has anisotropy that can reach up to 7%. The obtained results should be taken into account when calculating the thermal operating modes of electronic equipment elements mounted on copper plate radiators. |
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