Формирование столбиковых выводов для GaAs пиксельных детекторов

In the fabrication of hybrid ionizing radiation pixel detectors, the sensor array is connected to the readout device using columnar interconnects via flip-chip technology. A process for forming Pb/Sn and In columnar interconnects on GaAs sensor arrays has been developed and investigated. A TiW/Ag sy...

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Bibliographic Details
Date:2004
Main Authors: Berishvili, Z. V., Jangidze, L. V., Skhiladze, G. A., Melkadze, R. G., Lezhneva, T. M., Peradze, G. G.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2004
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Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.4.43
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment

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