Моделирование процессов бесконтактного химикомеханического изготовления подложек полупроводников
A physical model has been developed for operations of contactless chemical‑mechanical polishing and chemical cutting. Analytical expressions were obtained that relate the geometry of the formed surface and the processing rate to the physical parameters of the ongoing processes. These results can be...
Gespeichert in:
| Datum: | 2003 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2003
|
| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.2.36 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |
| Завантажити файл: |  |