Моделирование процессов бесконтактного химикомеханического изготовления подложек полупроводников

• Date: 2003
• Main Authors: Grigoriev, N. N., Kravetsky, M. Yu., Pashchenko, G. A., Sypko, S. A., Fomin, A. V.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2003
• Subjects: бесконтактное хими­ко‑механическое полирование; химическая резка; полупроводниковые подложки; физическая модель; технологические режимы
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.2.36
• Journal Title: Technology and design in electronic equipment

A physical model has been developed for operations of contactless chemical‑mechanical polishing and chemical cutting. Analytical expressions were obtained that relate the geometry of the formed surface and the processing rate to the physical parameters of the ongoing processes. These results can be...