Технологические средства изготовления микрополосковых линий для ГИС КВЧ-диапазона

The paper shows that the main challenges in manufacturing film hybrid integrated circuits for microwave and extremely high frequencies consist in selecting the substrate material, methods for precise conductor formation, and techniques and regimes for depositing high-conductivity metals without an a...

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Bibliographic Details
Published in:Технологія та конструювання в електронній апаратурі
Date:2002
Issue:4–5
Pages:34-39
ISSN:3083-6549
Author Affiliations:
  • A. E. Krendelev — Scientific Research Institute "Scientific Center", Zelenograd, Russia
Main Author: Krendelev, A. E.
Format: Article
Language:yo
Published: PE "Politekhperiodika", Book and Journal Publishers 2002
Subjects:
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2002.4-5.34
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Journal Title:Technology and design in electronic equipment
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Technology and design in electronic equipment