CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве
One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of micro...
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PE "Politekhperiodika", Book and Journal Publishers
2016
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oai:tkea.com.ua:article-2262025-05-30T19:30:53Z CFD-simulation of radiator for air cooling of microprocessors in a limitided space CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве Trofimov, V. E. Pavlov, A. L. Mokrousova, E. A. CFD-modeling radiator heat resistance impact jet microprocessor CFD-моделирование радиатор тепловое сопротивление импактные струи микропроцессоры One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of microprocessor operation.The temperature of the microprocessor housing is typically changed using a thermoelectric module. The cold surface of the module with controlled temperature is in direct thermal contact with the microprocessor housing designed for cooler installation. On the hot surface of the module a radiator is mounted. The radiator dissipates the cumulative heat flow from both the microprocessor and the module.High density PCB layout, the requirement of free access to the jumpers and interfaces, and the presence of numerous sensors limit the space for radiator mounting and require the use of an extremely compact radiator, especially in air cooling conditions. One of the possible solutions for this problem may reduce the area of the radiator heat-transfer surfaces due to a sharp growth of the heat transfer coefficient without increasing the air flow rate. To ensure a sharp growth of heat transfer coefficient on the heat-transfer surface one should make in the surface one or more dead-end cavities into which the impact air jets would flow.CFD simulation of this type of radiator has been conducted. The heat-aerodynamic characteristics and design recommendations for removing heat from microprocessors in a limited space have been determined. Проведено CFD-моделирование радиатора с компактной теплоотдающей поверхностью в виде тупиковых полостей, в которые втекают импактные воздушные струи. Получены тепло-аэродинамические характеристики и даны рекомендации по конструированию радиаторов такого типа для отвода тепла от микропроцессоров в ограниченном пространстве. PE "Politekhperiodika", Book and Journal Publishers 2016-12-27 Article Article Peer-reviewed Article application/pdf https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30 10.15222/TKEA2016.6.30 Technology and design in electronic equipment; No. 6 (2016): Tekhnologiya i konstruirovanie v elektronnoi apparature; 30-35 Технологія та конструювання в електронній апаратурі; № 6 (2016): Технология и конструирование в электронной аппаратуре; 30-35 3083-6549 3083-6530 uk https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30/196 Copyright (c) 2016 V. E. Trofimov, A. L. Pavlov, E. A. Mokrousova http://creativecommons.org/licenses/by/4.0/ |
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Technology and design in electronic equipment |
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| datestamp_date |
2025-05-30T19:30:53Z |
| collection |
OJS |
| language |
Ukrainian |
| topic |
CFD-моделирование радиатор тепловое сопротивление импактные струи микропроцессоры |
| spellingShingle |
CFD-моделирование радиатор тепловое сопротивление импактные струи микропроцессоры Trofimov, V. E. Pavlov, A. L. Mokrousova, E. A. CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| topic_facet |
CFD-modeling radiator heat resistance impact jet microprocessor CFD-моделирование радиатор тепловое сопротивление импактные струи микропроцессоры |
| format |
Article |
| author |
Trofimov, V. E. Pavlov, A. L. Mokrousova, E. A. |
| author_facet |
Trofimov, V. E. Pavlov, A. L. Mokrousova, E. A. |
| author_sort |
Trofimov, V. E. |
| title |
CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_short |
CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_full |
CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_fullStr |
CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_full_unstemmed |
CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_sort |
cfd-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве |
| title_alt |
CFD-simulation of radiator for air cooling of microprocessors in a limitided space |
| description |
One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of microprocessor operation.The temperature of the microprocessor housing is typically changed using a thermoelectric module. The cold surface of the module with controlled temperature is in direct thermal contact with the microprocessor housing designed for cooler installation. On the hot surface of the module a radiator is mounted. The radiator dissipates the cumulative heat flow from both the microprocessor and the module.High density PCB layout, the requirement of free access to the jumpers and interfaces, and the presence of numerous sensors limit the space for radiator mounting and require the use of an extremely compact radiator, especially in air cooling conditions. One of the possible solutions for this problem may reduce the area of the radiator heat-transfer surfaces due to a sharp growth of the heat transfer coefficient without increasing the air flow rate. To ensure a sharp growth of heat transfer coefficient on the heat-transfer surface one should make in the surface one or more dead-end cavities into which the impact air jets would flow.CFD simulation of this type of radiator has been conducted. The heat-aerodynamic characteristics and design recommendations for removing heat from microprocessors in a limited space have been determined. |
| publisher |
PE "Politekhperiodika", Book and Journal Publishers |
| publishDate |
2016 |
| url |
https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30 |
| work_keys_str_mv |
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| first_indexed |
2025-09-24T17:30:34Z |
| last_indexed |
2025-09-24T17:30:34Z |
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