CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ог­ра­ни­че­н­ном пространстве

CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ог­ра­ни­че­н­ном пространстве

One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of micro...

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Bibliographic Details
Date:2016
Main Authors: Trofimov, V. E., Pavlov, A. L., Mokrousova, E. A.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2016
Subjects:
CFD-моделирование
радиатор
тепловое сопротивление
импактные струи
микропроцессоры
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment

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https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30

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