Рассмотрены процессы получения микросварных соединений повышенной плотности в 3D интегральных схемах термозвуковой микросваркой, включающие использование повышенных частот ультразвука, применение микроинструмента с утонением рабочего торца и прецизион
The authors consider the processes of obtaining raised density microwelded connections in 3D-integrated microcircuits by the thermosonic microwelding. The processes include the use of the raised frequencies of ultrasound, application of the microinstrument with a thinning of the working end and prec...
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| Datum: | 2014 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2014
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2014.2-3.48 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | The authors consider the processes of obtaining raised density microwelded connections in 3D-integrated microcircuits by the thermosonic microwelding. The processes include the use of the raised frequencies of ultrasound, application of the microinstrument with a thinning of the working end and precision devices for ball formation, which provide reproducibility of connections quality.At a small step of contact pads, the use of a wire of small diameter (not more than 25 µm) is necessary for devices with a multilevel arrangement of leads and chess arrangement of contact pads on the chip, providing the maximum length of the formed crosspieces does not exceed 4–5 mm. |
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