Методы и механизмы геттерирования кремниевых структур в производстве интегральных микросхем
Increasing the degree of integration of hardware components imposes more stringent requirements for the reduction of the concentration of contaminants and oxidation stacking faults in the original silicon wafers with its preservation in the IC manufacturing process cycle. This causes high relevance...
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| Date: | 2013 |
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| Main Authors: | , , , , , |
| Format: | Article |
| Language: | English Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2013
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.2-3.43 |
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| Journal Title: | Technology and design in electronic equipment |