Технология сборки микросхем на гибком полиимидном носителе

• Date: 2010
• Main Authors: Plis, N. I., Verbitsky, V. G., Zhora, V. D., Volnistov, V. N., Grunyanskaya, V. P., Sergeyeva, N. N.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2010
• Subjects: сборка микросхем; гибкий полиимидный носитель; ультразвуковая сварка; качество сварных соединений
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2010.5-6.43
• Journal Title: Technology and design in electronic equipment

The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerat...