Анализ влияния способа соединения столбиковых выводов интегральных схем на их сопротивление
A model of a rigid pillar lead between the contact pads of the IC substrate and the mounted chip is considered. A method for determining the electrical resistance of the lead is proposed, and the resistance of the pillar lead for different connection methods is determined using this method. The resu...
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| Datum: | 2009 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2009
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2009.2.30 |
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| Назва журналу: | Technology and design in electronic equipment |