Анализ влияния способа соединения столбиковых выводов интегральных схем на их со­про­тив­ле­ние

A model of a rigid pillar lead between the contact pads of the IC substrate and the mounted chip is considered. A method for determining the electrical resistance of the lead is proposed, and the resistance of the pillar lead for different connection methods is determined using this method. The resu...

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Bibliographic Details
Date:2009
Main Authors: Hotra, Z. Yu., Dyachok, D. T.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2009
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Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2009.2.30
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment