Термоміграція довільно орієнтованих рідких лінійних зон Al-Si крізь пластини кремнію (110)

The paper analyzes the reasons and factors that allow avoiding faceting of non-oriented linear zones. It is shown that in the manufacture of semiconductor chips with a large perimeter and a reverse voltage of 2000 V, the conditions sine qua non to create isolating walls on silicon wafers with an ori...

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Bibliographic Details
Date:2021
Main Authors: Polukhin, Оlекsіі, Kravchina, Vitalii
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2021
Subjects:
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2021.5-6.33
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment