Влияние легирующих добавок на теплостойкость и теплопередачу никелевых покрытий корпусов ИС
Using modern diagnostic microanalysis tools, the regularities of changes in the electrophysical parameters of Ni‑B electroplated coatings of IC packages during ultrasonic welding of internal Al leads and package sealing have been established. An optimal electrolyte composition has been selected, pr...
Gespeichert in:
| Datum: | 2008 |
|---|---|
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2008
|
| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2008.2.56 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipment| Zusammenfassung: | Using modern diagnostic microanalysis tools, the regularities of changes in the electrophysical parameters of Ni‑B electroplated coatings of IC packages during ultrasonic welding of internal Al leads and package sealing have been established. An optimal electrolyte composition has been selected, providing increased heat resistance of IC packages with alloyed nickel coatings, which, in combination with local gold plating, enables the mounting of chips through a eutectic Si‑Au sublayer.
|
|---|