Исследование процессов теплообмена в коллекторных термосифонах коммутационных плат высокой степени интеграции
The processes of heat transfer and fluid dynamics of the coolant in the channels of a collector thermosyphon integrated into a heat-loaded switching board have been investigated. The most rational geometry of evaporator channels has been determined. Experimental dependencies of the surface temperat...
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| Datum: | 2007 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2007
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.6.36 |
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| Назва журналу: | Technology and design in electronic equipment |