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Поверхностный монтаж мощных бескорпусных MOSFET-транзисторов

The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microint...

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Bibliographic Details
Date:2006
Main Authors: Anufriev, D. L., Rubtsevich, I. I., Kerentsev, A. F.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2006
Subjects:
поверхностный монтаж
бескорпусный MOSFET-транзистор
золото-кремниевая эвтектика
кристаллодержатель
вибрационная пайка
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.2.45
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment
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Summary:The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microinterferometry. Results on electrical and thermal parameters are presented. It was established that mounting chips on Au–Si eutectic significantly increases the stability of the thermal parameters of high-power transistors under cyclic temperature changes.

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