Низкотемпературная модификация медных пленок под воздействием атомарного водорода

• Date: 2006
• Main Authors: Zhavzharov, E. L., Matyushin, V. M.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2006
• Subjects: атомарный водород; медные пленки; адгезия; когезия
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.1.50
• Journal Title: Technology and design in electronic equipment

The possibility of low-temperature modification of the properties of thin copper films under the influence of atomic hydrogen is considered. The results of an experimental study of changes in the adhesion and cohesion properties of copper films within the "copper – silicon" hetero...