Search Results - Sypko, S.A.

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    Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials by Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.

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    Balance model for contactless chemo-mechanical polishing of wafers by Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.

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