Integrated through-silicon-via-based inductor design in buck converter for improved efficiency
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the d...
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| Дата: | 2023 |
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| Автори: | , , , , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
National Technical University "Kharkiv Polytechnic Institute" and State Institution “Institute of Technical Problems of Magnetism of the National Academy of Sciences of Ukraine”
2023
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| Теми: | |
| Онлайн доступ: | http://eie.khpi.edu.ua/article/view/273795 |
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| Назва журналу: | Electrical Engineering & Electromechanics |