Integrated through-silicon-via-based inductor design in buck converter for improved efficiency
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the d...
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| Date: | 2023 |
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| Main Authors: | , , , , |
| Format: | Article |
| Language: | English |
| Published: |
National Technical University "Kharkiv Polytechnic Institute" and Аnatolii Pidhornyi Institute of Power Machines and Systems of NAS of Ukraine
2023
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| Subjects: | |
| Online Access: | http://eie.khpi.edu.ua/article/view/273795 |
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| Journal Title: | Electrical Engineering & Electromechanics |