Integrated through-silicon-via-based inductor design in buck converter for improved efficiency

• Datum: 2023
• Hauptverfasser: Namoune, A., Taleb, R., Mansour, N., Benzidane, M. R., Boukortt, A.
• Format: Artikel
• Sprache: Englisch
• Veröffentlicht: National Technical University "Kharkiv Polytechnic Institute" and Аnatolii Pidhornyi Institute of Power Machines and Systems of NAS of Ukraine 2023
• Schlagworte: through-silicon-via-based inductor; 3D integration; buck converter; efficiency
• Online Zugang: http://eie.khpi.edu.ua/article/view/273795
• Назва журналу: Electrical Engineering & Electromechanics

Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the d...