Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation
Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate th...
Збережено в:
| Дата: | 2018 |
|---|---|
| Автори: | , , , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
Інститут проблем міцності ім. Г.С. Писаренко НАН України
2018
|
| Назва видання: | Проблемы прочности |
| Теми: | |
| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/173818 |
| Теги: |
Додати тег
Немає тегів, Будьте першим, хто поставить тег для цього запису!
|
| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation / C.P. Wang, J.K. Fan, F.G. Li, J.C. Liu // Проблемы прочности. — 2018. — № 1. — С. 106-111. — Бібліогр.: 13 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
irk-123456789-173818 |
|---|---|
| record_format |
dspace |
| spelling |
irk-123456789-1738182020-12-23T01:26:14Z Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation Wang, C.P. Fan, J.K. Li, F.G. Liu, J.C. Научно-технический раздел Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate that both high-angle grain boundaries and misorientation increase with strain. The grains finer and more homogeneous. In addition, the microstructure within the shear band demonstrates a distinct preferred orientation. The crystal <110> direction is parallel to the shear direction, and the crystal {111} inclines to the plane shear surface. A torsion-induced bar specimen includes a {011} <211> brass texture, {011} <100> Gaussian texture, and stronger {112} <111> copper texture. Деформация кручения рассматривается как перспективный метод получения градиентных конструкционных материалов. Чистую медь подвергали большим пластическим деформациям при кручении. Для изучения микроструктурных изменений использован дифракционный анализ (EBSD). Показано, что большеугловые границы зерен и разориентировка увеличиваются с ростом степени деформации, зерна более мелкие и однородные. Микроструктура в полосе сдвига имеет выраженную преимущественную ориентировку. Направление кристалла <110> параллельно направлению сдвига, а кристалл {111} наклонен к поверхности плоского сдвига. Брус, подвергнутый кручению, имеет латунную текстуру {011}<211>, гауссову текстуру {011}<100> и более прочную медную текстуру {112}<111>. 2018 Article Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation / C.P. Wang, J.K. Fan, F.G. Li, J.C. Liu // Проблемы прочности. — 2018. — № 1. — С. 106-111. — Бібліогр.: 13 назв. — англ. 0556-171X http://dspace.nbuv.gov.ua/handle/123456789/173818 539.4 en Проблемы прочности Інститут проблем міцності ім. Г.С. Писаренко НАН України |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| language |
English |
| topic |
Научно-технический раздел Научно-технический раздел |
| spellingShingle |
Научно-технический раздел Научно-технический раздел Wang, C.P. Fan, J.K. Li, F.G. Liu, J.C. Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation Проблемы прочности |
| description |
Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate that both high-angle grain boundaries and misorientation increase with strain. The grains finer and more homogeneous. In addition, the microstructure within the shear band demonstrates a distinct preferred orientation. The crystal <110> direction is parallel to the shear direction, and the crystal {111} inclines to the plane shear surface. A torsion-induced bar specimen includes a {011} <211> brass texture, {011} <100> Gaussian texture, and stronger {112} <111> copper texture. |
| format |
Article |
| author |
Wang, C.P. Fan, J.K. Li, F.G. Liu, J.C. |
| author_facet |
Wang, C.P. Fan, J.K. Li, F.G. Liu, J.C. |
| author_sort |
Wang, C.P. |
| title |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation |
| title_short |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation |
| title_full |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation |
| title_fullStr |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation |
| title_full_unstemmed |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation |
| title_sort |
electron backscatter diffraction analysis of the microstructure fineness in pure copper under torsional deformation |
| publisher |
Інститут проблем міцності ім. Г.С. Писаренко НАН України |
| publishDate |
2018 |
| topic_facet |
Научно-технический раздел |
| url |
http://dspace.nbuv.gov.ua/handle/123456789/173818 |
| citation_txt |
Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation / C.P. Wang, J.K. Fan, F.G. Li, J.C. Liu // Проблемы прочности. — 2018. — № 1. — С. 106-111. — Бібліогр.: 13 назв. — англ. |
| series |
Проблемы прочности |
| work_keys_str_mv |
AT wangcp electronbackscatterdiffractionanalysisofthemicrostructurefinenessinpurecopperundertorsionaldeformation AT fanjk electronbackscatterdiffractionanalysisofthemicrostructurefinenessinpurecopperundertorsionaldeformation AT lifg electronbackscatterdiffractionanalysisofthemicrostructurefinenessinpurecopperundertorsionaldeformation AT liujc electronbackscatterdiffractionanalysisofthemicrostructurefinenessinpurecopperundertorsionaldeformation |
| first_indexed |
2023-10-18T22:34:59Z |
| last_indexed |
2023-10-18T22:34:59Z |
| _version_ |
1796155895780999168 |