Influence of magnetic field configuration and strength on plasma parameters and efficiency of coatings deposition in magnetron sputtering system
Paper presents results of evaluation of the influence of the parameters of the additional anode electromagnetic trap for discharge electrons in a magnetron sputtering system. The efficiency of ionization processes is also investigated. It has been shown experimentally that a slight increase of the a...
Збережено в:
Дата: | 2022 |
---|---|
Автори: | , , , , |
Формат: | Стаття |
Мова: | English |
Опубліковано: |
Національний науковий центр «Харківський фізико-технічний інститут» НАН України
2022
|
Назва видання: | Problems of Atomic Science and Technology |
Теми: | |
Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/195896 |
Теги: |
Додати тег
Немає тегів, Будьте першим, хто поставить тег для цього запису!
|
Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
Цитувати: | Influence of magnetic field configuration and strength on plasma parameters and efficiency of coatings deposition in magnetron sputtering system / А.G. Chunadra, К.N. Sereda, I.K. Tarasov, V.A. Makhlai, B.M. Kozhukhovskyi // Problems of Atomic Science and Technology. — 2022. — № 6. — С. 103-106. — Бібліогр.: 6 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of UkraineРезюме: | Paper presents results of evaluation of the influence of the parameters of the additional anode electromagnetic trap for discharge electrons in a magnetron sputtering system. The efficiency of ionization processes is also investigated. It has been shown experimentally that a slight increase of the additional anode magnetic field leads to an increase of plasma density in the discharge on several times. The presence of an anode electromagnetic trap causes additional ionization zones. An increase of anode magnetic field leads to an increase of the average energy of charged discharge plasma particles. As the result, it was observed an intensification of the target material sputtering process as well as an increase of coatings deposition rate. In addition, a slight increase in the magnitude of the anode magnetic field has a positive effect on the quality and purity of the deposited coatings. |
---|