CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ог­ра­ни­че­н­ном пространстве

• Date: 2016
• Main Authors: Trofimov, V. E., Pavlov, A. L., Mokrousova, E. A.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2016
• Subjects: CFD-моделирование; радиатор; тепловое сопротивление; импактные струи; микропроцессоры
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.6.30
• Journal Title: Technology and design in electronic equipment

One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of micro...