Методы и механизмы геттерирования кремниевых структур в производстве интегральных микросхем

• Date: 2013
• Main Authors: Pilipenko, V. A., Gorushko, V. A., Petlitskiy, A. N., Ponaryadov, V. V., Turtsevich, A. S., Shvedov, S. V.
• Format: Article
• Language: English; Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2013
• Subjects: кремний; геттер; лазер; быстродиффундирующая примесь; центр геттерирования; дислокация; дефект упаковки
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.2-3.43
• Journal Title: Technology and design in electronic equipment

Increasing the degree of integration of hardware components imposes more stringent requirements for the reduction of the concentration of contaminants and oxidation stacking faults in the original silicon wafers with its preservation in the IC manufacturing process cycle. This causes high relevance...