Investigation of temperature fields in microelectronic devices of layered structure with through inclusions

Investigation of temperature fields in microelectronic devices of layered structure with through inclusions

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Bibliographic Details
Date:2017
Main Authors: V. I. Gavrysh, R. B. Tushnitskij, Ja. Krajovskij, E. V. Levus
Format: Article
Language:English
Published: 2017
Series:Electronic modeling
Online Access:http://jnas.nbuv.gov.ua/article/UJRN-0000800015
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Journal Title:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
id open-sciencenbuvgovua-39347
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spelling open-sciencenbuvgovua-393472024-02-29T11:45:35Z Investigation of temperature fields in microelectronic devices of layered structure with through inclusions V. I. Gavrysh R. B. Tushnitskij Ja. Krajovskij E. V. Levus 0204-3572 2017 en Electronic modeling http://jnas.nbuv.gov.ua/article/UJRN-0000800015 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Electronic modeling
spellingShingle Electronic modeling
V. I. Gavrysh
R. B. Tushnitskij
Ja. Krajovskij
E. V. Levus
Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
format Article
author V. I. Gavrysh
R. B. Tushnitskij
Ja. Krajovskij
E. V. Levus
author_facet V. I. Gavrysh
R. B. Tushnitskij
Ja. Krajovskij
E. V. Levus
author_sort V. I. Gavrysh
title Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
title_short Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
title_full Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
title_fullStr Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
title_full_unstemmed Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
title_sort investigation of temperature fields in microelectronic devices of layered structure with through inclusions
publishDate 2017
url http://jnas.nbuv.gov.ua/article/UJRN-0000800015
work_keys_str_mv AT vigavrysh investigationoftemperaturefieldsinmicroelectronicdevicesoflayeredstructurewiththroughinclusions
AT rbtushnitskij investigationoftemperaturefieldsinmicroelectronicdevicesoflayeredstructurewiththroughinclusions
AT jakrajovskij investigationoftemperaturefieldsinmicroelectronicdevicesoflayeredstructurewiththroughinclusions
AT evlevus investigationoftemperaturefieldsinmicroelectronicdevicesoflayeredstructurewiththroughinclusions
first_indexed 2025-07-17T19:17:58Z
last_indexed 2025-07-17T19:17:58Z
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