Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing by Pashchenko, G.A., Kravetskyi, M.Yu., Fomin, A.V.

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Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials by Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.

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Отримання мікропоруватих шарів GaAs методом хімічного травлення на підкладках р-GaAs та їхня фотолюмінісценція... by Paschenko, G. A., Kravetsky, M. Yu., Fomin, A. V.

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Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing by Fomin, A.V., Pashchenko, G.A., Kravetskyi, M.Yu., Lutsyshyn, I.G.

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Balance model for contactless chemo-mechanical polishing of wafers by Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.

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